ZHCSU09I July   2004  – February 2025 LP2981 , LP2981A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
        1. 6.3.3.1 Current Limit (Legacy Chip)
        2. 6.3.3.2 Current Limit (New Chip)
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors
          2. 7.1.1.1.2 Ceramic Capacitors
          3. 7.1.1.1.3 Aluminum Capacitors
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input and Output Capacitor Requirements
        1. 7.1.2.1 Input Capacitor
        2. 7.1.2.2 Output Capacitor
          1. 7.1.2.2.1 Output Capacitor (Legacy Chip)
          2. 7.1.2.2.2 Output Capacitor (New Chip)
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

8.1 Device Nomenclature

Table 8-1 Available Options
PRODUCT(1) VOUT
LP2981c-xxyyyz

c is the accuracy specification for the legacy chip (A or blank). See the Electrical Characteristics for more information. This character is insignificant for the new chip.yyy is the package designator (DBV = SOT-23).z is the reel designator size. See the Package Addendum for more information on package quantity.xx is the nominal output voltage (for example, 33 = 3.3V; 50 = 5.0V).This device ships with either the legacy chip (CSO: DLN or GF8) or the new chip (CSO: RFB), which uses the latest manufacturing flow.The reel packaging label provides CSO information to distinguish which chip is used. Device performance for new and legacy chips is denoted throughout the document.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com.