ZHCSHO0C February   2018  – March 2023 LMZM23600

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Control Scheme
      2. 8.3.2 Soft-Start Function
      3. 8.3.3 Enable and External UVLO Function
      4. 8.3.4 Current Limit
      5. 8.3.5 Hiccup Mode
      6. 8.3.6 Power Good (PGOOD) Function
      7. 8.3.7 MODE/SYNC Function
        1. 8.3.7.1 Forced PWM Mode
        2. 8.3.7.2 Auto PFM Mode
        3. 8.3.7.3 Dropout Mode
        4. 8.3.7.4 SYNC Operation
      8. 8.3.8 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
      2. 8.4.2 FPWM Operation
      3. 8.4.3 Auto PFM Mode Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Maximum Input Voltage for VOUT < 2.5 V
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Input Capacitor Selection
        3. 9.2.2.3 Output Capacitor Selection
        4. 9.2.2.4 Feedback Voltage Divider for Adjustable Output Voltage Versions
        5. 9.2.2.5 RPU - PGOOD Pullup Resistor
        6. 9.2.2.6 VIN Divider and Enable
      3. 9.2.3 Application Curves
        1. 9.2.3.1 VOUT = 5 V
        2. 9.2.3.2 VOUT = 3.3 V
        3. 9.2.3.3 VOUT = 12 V
        4. 9.2.3.4 VOUT = 15 V
        5. 9.2.3.5 VOUT = 2.5 V
        6. 9.2.3.6 VOUT = 1.2 V and VOUT = 1.8 V
        7. 9.2.3.7 VOUT = 5 V and 3.3 V Fixed Output Options
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Supply Voltage Range
      2. 9.4.2 Supply Current Capability
      3. 9.4.3 Supply Input Connections
        1. 9.4.3.1 Voltage Drops
        2. 9.4.3.2 Stability
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Thermal Design
      2. 9.5.2 Layout Examples
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Best Design Practices

  • Do not: Exceed the absolute maximum ratings of the device.
  • Do not: Exceed the ESD ratings of the device.
  • Do not: Exceed the recommended operating conditions.
  • Do not: Allow the EN or MODE/SYNC terminals to float.
  • Do not: Allow the output voltage to exceed the input voltage, nor go below ground.
  • Do: Follow all of the guidelines and suggestions found in this data sheet, before committing your design to production.
  • Do: Review your designs with TI Application Engineers on the E2E forum.