ZHCSD60D June   2012  – August 2018 LMZ20502

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      VOUT = 1.8V 时自动模式下的典型效率
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Nano Scale Package
      2. 7.3.2 Internal Synchronous Rectifier
      3. 7.3.3 Current Limit Protection
      4. 7.3.4 Start-Up
      5. 7.3.5 Dropout Behavior
      6. 7.3.6 Power Good Flag Function
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 PFM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Setting The Output Voltage
        3. 8.2.1.3 Output and Feed-Forward Capacitors
        4. 8.2.1.4 Input Capacitors
        5. 8.2.1.5 Maximum Ambient Temperature
        6. 8.2.1.6 Options
      2. 8.2.2 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Soldering Information
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 开发支持
        1. 11.1.2.1 使用 WEBENCH® 工具创建定制设计
      3. 11.1.3 文档支持
        1. 11.1.3.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIL|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) LMZ20502 UNIT
USIP (SIL)
8 PINS
RθJA Junction-to-ambient thermal resistance 42.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.8
RθJB Junction-to-board thermal resistance 9.4
ψJT Junction-to-top characterization parameter 1.5
ψJB Junction-to-board characterization parameter 9.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.8
(1) The values given in this table are only valid for comparison with other packages and can not be used for design purposes. For design information please see the Maximum Ambient Temperature section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.