ZHCSPF6B february   2022  – may 2023 LMQ66410 , LMQ66420 , LMQ66430

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Enable, Start-Up, and Shutdown
      2. 8.3.2  Adjustable Switching Frequency (with RT)
      3. 8.3.3  Power-Good Output Operation
      4. 8.3.4  Internal LDO, VCC, and VOUT/FB Input
      5. 8.3.5  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      6. 8.3.6  Output Voltage Selection
      7. 8.3.7  Spread Spectrum
      8. 8.3.8  Soft Start and Recovery from Dropout
        1. 8.3.8.1 Recovery from Dropout
      9. 8.3.9  Current Limit and Short Circuit
      10. 8.3.10 Thermal Shutdown
      11. 8.3.11 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 Auto Mode – Light Load Operation
          1. 8.4.3.2.1 Diode Emulation
          2. 8.4.3.2.2 Frequency Reduction
        3. 8.4.3.3 FPWM Mode – Light Load Operation
        4. 8.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Synchronous Buck Regulator at 400 kHz
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1  Choosing the Switching Frequency
        2. 9.2.3.2  Setting the Output Voltage
          1. 9.2.3.2.1 VOUT / FB for Adjustable Output
        3. 9.2.3.3  Inductor Selection
        4. 9.2.3.4  Output Capacitor Selection
        5. 9.2.3.5  Input Capacitor Selection
        6. 9.2.3.6  CBOOT
        7. 9.2.3.7  VCC
        8. 9.2.3.8  CFF Selection
        9. 9.2.3.9  External UVLO
        10. 9.2.3.10 Maximum Ambient Temperature
      4. 9.2.4 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Ground and Thermal Considerations
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • 功能安全型
  • 专用于工业应用：
    • 结温范围：–40°C 至 +150°C
    • 关键引脚之间的 NC 引脚可提高可靠性
    • 出色的引脚 FMEA
    • 高达 42V 的输入瞬态保护
    • 宽输入电压范围（启动后）：2.7V（下降阈值）至 36V
    • 可调输出高达 VIN 的 95%，并提供 3.3V 和 5V 固定 VOUT 选项
  • 进行了优化，可满足低 EMI 要求：
    • 集成旁路和启动电容器可降低 EMI
    • 双随机展频可降低峰值发射
    • 增强型 HotRod™ QFN 封装可更大限度地减少开关节点振铃
    • 可调 FSW：200kHz 至 2.2MHz（采用 RT 引脚）
  • 在 1 mA 时效率高于 85%
  • 微型解决方案尺寸和低组件成本：
    • 集成输入旁路电容器和自举电容器，可降低 EMI
    • 具有可湿性侧面的 2.6mm x 2.6mm 增强型 HotRod™ QFN 封装
    • 内部控制环路补偿