SNAS517E November   2011  – September 2015 LMP91050

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface
    7. 7.7 Timing Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Programmable Gain Amplifier
      2. 8.3.2 External Filter
      3. 8.3.3 Offset Adjust
      4. 8.3.4 Common-Mode Generation
      5. 8.3.5 CSB
        1. 8.3.5.1 SCLK
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 SPI Interface
        1. 8.5.1.1 Interface Pins
        2. 8.5.1.2 Communication Protocol
        3. 8.5.1.3 Registers Organization
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration
      2. 8.6.2 DAC Configuration
      3. 8.6.3 SDIO Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(2)(1)(4)
MIN MAX UNIT
Supply Voltage (VDD) –0.3 6 V
Voltage at Any Pin –0.3 VDD + 0.3 V
Input Current at Any Pin 5 mA
Junction Temperature(3) 150 °C
Storage Temperature, Tstg –65 150 °C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PC board.
(4) For soldering specifications:  see product folder at www.ti.com and SNOA549.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1250
Machine Model ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage 2.7 5.5 V
Junction Temperature(2) –40 105 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PC board.

7.4 Thermal Information

THERMAL METRIC(1) LMP91050 UNIT
DGS (VSSOP)
10 PINS
RθJA Junction-to-ambient thermal resistance 176 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

The following specifications apply for VDD = 3.3 V, VCM = 1.15 V, unless otherwise specified. All other limits apply to TA = TJ = +25°C.(1)
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
POWER SUPPLY
VDD Supply voltage 2.7 3.3 5.5 V
IDD Supply current All analog block ON 3.1 3.7 4.2 mA
Power-down supply current All analog block OFF 45 85 121 μA
OFFSET CANCELLATION (OFFSET DAC)
Resolution 256 steps
LSB All gains 33.8 mV
DNL -1 2 LSB
Error Output referred offset error, all gains ±100 mV
Offset adjust range Output referred, all gains 0.2 VDD – 0.2 V
DAC settling time 480 μs
PROGRAMMABLE GAIN AMPLIFIER (PGA) 1ST STAGE, RL = 10 kΩ, CL = 15 pF
IBIAS Bias current 5 pA
TA = –40°C to +85°C 200
VINMAX
_HGM		 Max input signal high-gain mode Referenced to CMOUT voltage, it refers to the maximum voltage at the IN pin before clipping; It includes dark voltage of the thermopile and signal voltage. ±2 mV
VINMAX
_LGM		 Max input signal low-gain mode ±12 mV
VOS Input offset voltage -165 µV
G _HGM Gain high-gain mode 250 V/V
G_LGM Gain low-gain mode 42 V/V
GE Gain error Both HGM and LGM 2.5%
VOUT Output voltage range 0.5 VDD – 0.5 V
PhDly Phase delay 1-mV input step signal, HGM, VOUT measured at Vdd/2 6 μs
TCPhDly Phase delay variation with temperature 1-mV input step signal, HGM, VOUT measured at Vdd/2, 416 ns
SSBW Small signal bandwidth Vin = 1mVpp, Gain = 250 V/V 18 kHz
Cin Input capacitance 100 pF
PROGRAMMABLE GAIN AMPLIFIER (PGA) 2ND STAGE, RS = 1 kΩ, CL = 1 µF
VINMAX Max input signal GAIN = 4 V/V 1.65 V
VINMIN Min input signal 0.82 V
G Gain Programmable in 4 steps 4 32 V/V
GE Gain error Any gain 2.5 %
VOUT Output voltage range 0.2 VDD – 0.2 V
PhDly Phase delay 100-mV input sine 35-kHz signal, Gain = 8, VOUT measured at 1.65 V, RL = 10 kΩ
 1 µs
TCPhDly Phase delay variation with temperature 250-mV input step signal, Gain = 8, VOUT measured at Vdd/2 84 ns
SSBW Small signal bandwidth Gain = 32 V/V 360 kHz
Cin Input capacitance 5 pF
CLOAD,
OUT		 OUT pin load capacitance Series RC 1 µF
RLOAD,
OUT		 OUT pin load resistance Series RC 1 kΩ
COMBINED AMPLIFIER CHAIN SPECIFICATION
en Input-referred noise density Combination of both current and voltage noise, with a 86kΩ source impedance at 5Hz, Gain = 7986 30 nV/√Hz
Input-referred integrated noise Combination of both current and voltage noise, with a 86kΩ source impedance 0.1Hz to 10Hz, Gain = 7986 0.1 0.12(6) µVrms
G Gain PGA1 GAIN = 42, PGA2 GAIN = 4 167 V/V
PGA1 GAIN = 42, PGA2 GAIN = 8 335
PGA1 GAIN = 42, PGA2 GAIN = 16 669
PGA1 GAIN = 42, PGA2 GAIN = 32 1335
PGA1 GAIN = 250, PGA2 GAIN = 4 1002
PGA1 GAIN = 250, PGA2 GAIN = 8 2004
PGA1 GAIN = 250, PGA2 GAIN = 16 4003
PGA1 GAIN = 250, PGA2 GAIN = 32 7986
GE Gain error Any gain 5%
TCCGE Gain temp coefficient (4) TA = –40°C to +85°C 100 ppm/°C
PSRR Power supply rejection ratio DC, 3-V to 3.6-V supply, gain = 1002 V/V 90 110 dB
PhDly Phase delay 1-mV input step signal, Gain = 1002, VOUT measured at Vdd/2 9 µs
TCPhDly Phase delay variation with temperature (5) 1-mV input step signal, Gain=1002, VOUT measured at Vdd/2, TA = –40°C to +85°C 500 ns
TCVOS Output offset voltage temperature drift (4) Gain = 167 V/V, TA = –40°C to +85°C –0.525 0.525 mV/°C
Gain = 335 V/V, TA = –40°C to +85°C –0.6 0.6
Gain = 669 V/V, TA = –40°C to +85°C –0.9 0.9
Gain = 1335 V/V, TA = –40°C to +85°C –1.5 1.5
Gain = 1002 V/V, TA = –40°C to +85°C –1.2 1.2
Gain = 2004 V/V, TA = –40°C to +85°C –1.9 1.9
Gain = 4003 V/V, TA = –40°C to +85°C –3.7 3.7
Gain = 7986V/V, TA = –40°C to +85°C –7.1 7.1
COMMON-MODE GENERATOR
VCM Common-mode voltage Programmable, see Common-Mode Generation 1.15 or
2.59		 V
VCM accuracy 2%
CLOAD CMOut load capacitance 10 nF
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.
(3) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.
(4) TCCGE and TCVOS are calculated by taking the largest slope between -40°C and 25°C linear interpolation and 25°C and 85°C linear interpolation.
(5) TCPhDly is largest change in phase delay between -40°C and 25°C measurements and 25°C and 85°C measurements.
(6) Specified by design and characterization. Not tested on shipped production material.

7.6 SPI Interface

The following specifications apply for VDD = 3.3 V, VCM = 1.15 V, CL = 15 pF, unless otherwise specified. All other limits apply to TA = TJ = +25°C.(1)
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
VIH Logic input high 0.7 × VDD V
VIL Logic input low 0.8 V
VOH Logic output high 2.6 V
VOL Logic output low 0.4 V
IIH/IIL Input digital leakage current –100 100 nA
TA = –40°C to +85°C –200 200
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.
(3) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.

7.7 Timing Characteristics

The following specifications apply for VDD = 3.3 V, VCM = 1.15 V, CL = 15 pF, unless otherwise specified. All other limits apply to TA = TJ = +25°C.(1)
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
tWU Wake-up time 1 ms
fSCLK Serial clock frequency 10 MHz
tPH SCLK pulse width high 0.4 / fSCLK ns
tPL SCLK pulse width low 0.4 / fSCLK ns
tCSS CSB set-up time 10 ns
tCSH CSB hold time 10 ns
tSU SDI set-up time prior to rise edge of SCLK 10 ns
tSH SDI hold time prior to rise edge of SCLK 10 ns
tDOD1 SDO disable time after rise edge of CSB 45 ns
tDOD2 SDO disable time after 16th rise edge of SCLK 45 ns
tDOE SDO enable time from the fall edge of 8th SCLK 35 ns
tDOA SDO access time after the fall edge of SCLK 35 ns
tDOH SDO hold time after the fall edge of SCLK 5 ns
tDOR SDO rise time 5 ns
tDOF SDO fall time 5 ns
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.
(3) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.
LMP91050 30164112.png Figure 1. SPI Timing Diagram
LMP91050 30164113.gif Figure 2. SPI Set-Up Hold Time
LMP91050 30164117.png Figure 3. SDO Disable Time After 16th Rise Edge of SCLK
LMP91050 30164116.png Figure 4. SDO Access Time (tDOA) and SDO Hold Time (tDOH) After the Fall Edge of SCLK
LMP91050 30164118.png Figure 5. SDO Enable Time from the Fall Edge of 8th SCLK
LMP91050 30164119.png Figure 6. SDO Disable Time after Rise Edge of CSB
LMP91050 30164120.png Figure 7. SDO Rise and Fall Times

7.8 Typical Characteristics

VDD = +3.3 V, VCM = 1.15 V, and TA = 25°C unless otherwise noted
LMP91050 30164125.gif Figure 8. Gain = 167 V/V vs. Temperature
LMP91050 30164123.gif Figure 10. Gain = 669 V/V vs. Temperature
LMP91050 30164126.gif Figure 12. Gain = 2004 V/V vs. Temperature
LMP91050 30164128.gif Figure 14. Output Offset vs. Temperature
LMP91050 30164143.gif Figure 16. Input Bias Current vs. Temperature
LMP91050 30164131.gif Figure 18. Supply Current vs. Supply Voltage
LMP91050 30164129.gif Figure 20. Output Offset vs. Supply Voltage
LMP91050 30164124.gif Figure 9. Gain = 335 V/V vs. Temperature
LMP91050 30164127.gif Figure 11. Gain = 1002 V/V vs. Temperature
LMP91050 30164122.gif Figure 13. Phase Delay vs. Temperature
LMP91050 301641100.gif Figure 15. Common-Mode Voltage vs. Temperature
LMP91050 30164142.gif Figure 17. Supply Current vs. Temperature
LMP91050 30164130.gif Figure 19. Power-Down Supply Current vs. Supply Voltage