ZHCSOM5D April   2006  – September 2021 LMH6321

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3描述
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 Thermal Information
    4. 5.4 ±15 V Electrical Characteristics
    5. 5.5 ±5 V Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6Application Hints
    1. 6.1  Buffers
    2. 6.2  Supply Bypassing
    3. 6.3  Load Impedence
    4. 6.4  Source Inductance
    5. 6.5  Overvoltage Protection
    6. 6.6  Bandwidth and Stability
    7. 6.7  Output Current and Short Circuit Protection
    8. 6.8  Thermal Management
      1. 6.8.1 Heatsinking
      2. 6.8.2 Determining Copper Area
      3. 6.8.3 Procedure
      4. 6.8.4 Example
    9. 6.9  Error Flag Operation
    10. 6.10 Single Supply Operation
    11. 6.11 Slew Rate
  7. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 术语表
  8. 8Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • KTW|7
  • DDA|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

Heatsinking

For some applications, a heat sink may be required with the LMH6321. This depends on the maximum power dissipation and maximum ambient temperature of the application. To accomplish heat sinking, the tabs on DDPAK and SO PowerPAD package may be soldered to the copper plane of a PCB for heatsinking (note that these tabs are electrically connected to the most negative point in the circuit, for example,V).

Heat escapes from the device in all directions, mainly through the mechanisms of convection to the air above it and conduction to the circuit board below it and then from the board to the air. Natural convection depends on the amount of surface area that is in contact with the air. If a conductive plate serving as a heatsink is thick enough to ensure perfect thermal conduction (heat spreading) into the far recesses of the plate, the temperature rise would be simply inversely proportional to the total exposed area. PCB copper planes are, in that sense, an aid to convection, the difference being that they are not thick enough to ensure perfect conduction. Therefore, eventually we will reach a point of diminishing returns (as seen in Figure 6-5). Very large increases in the copper area will produce smaller and smaller improvement in thermal resistance. This occurs, roughly, for a 1 inch square of 1 oz copper board. Some improvement continues until about 3 square inches, especially for 2 oz boards and better, but beyond that, external heatsinks are required. Ultimately, a reasonable practical value attainable for the junction to ambient thermal resistance is about 30 °C/W under zero air flow.

A copper plane of appropriate size may be placed directly beneath the tab or on the other side of the board. If the conductive plane is placed on the back side of the PCB, it is recommended that thermal vias be used per JEDEC Standard JESD51-5.