ZHCSOM5D April   2006  – September 2021 LMH6321

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3描述
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 Thermal Information
    4. 5.4 ±15 V Electrical Characteristics
    5. 5.5 ±5 V Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6Application Hints
    1. 6.1  Buffers
    2. 6.2  Supply Bypassing
    3. 6.3  Load Impedence
    4. 6.4  Source Inductance
    5. 6.5  Overvoltage Protection
    6. 6.6  Bandwidth and Stability
    7. 6.7  Output Current and Short Circuit Protection
    8. 6.8  Thermal Management
      1. 6.8.1 Heatsinking
      2. 6.8.2 Determining Copper Area
      3. 6.8.3 Procedure
      4. 6.8.4 Example
    9. 6.9  Error Flag Operation
    10. 6.10 Single Supply Operation
    11. 6.11 Slew Rate
  7. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 术语表
  8. 8Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • KTW|7
  • DDA|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC1 LMH6321 UNIT
DDA SO Power Pad DDAPAK
8 Pins 7 Pins
R θJA Junction-to-ambient thermal resistance 37.8 21.5 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 51.6 34.4 °C/W
R θJB Junction-to-board thermal resistance 11.7 6.7 °C/W
ψ JT Junction-to-top characterization parameter 2.5 3.2 °C/W
ψ JB Junction-to-board characterization parameter 11.7 6.3 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance 3.6 1.1 °C/W