SNLS289D April   2008  – September 2015 LMH1982

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supported Standards and Timing Formats
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
        1. 7.4.1.1 Free Run Mode
        2. 7.4.1.2 Genlock Mode
          1. 7.4.1.2.1 Genlock Mode State Diagram
            1. 7.4.1.2.1.1 Loss of Reference (LOR)
              1. 7.4.1.2.1.1.1 Free Run during LOR
              2. 7.4.1.2.1.1.2 Holdover during LOR
    5. 7.5 Programming
      1. 7.5.1 I2C Interface Protocol
        1. 7.5.1.1 Write Sequence
        2. 7.5.1.2 Read Sequence
        3. 7.5.1.3 I2C Enable Control Pin
    6. 7.6 Register Maps
      1. 7.6.1 I2C Interface Control Register Definitions
        1. 7.6.1.1 Genlock and Input Reference Control Registers
        2. 7.6.1.2 Genlock Status And Lock Control Register
        3. 7.6.1.3 Input Control Register
        4. 7.6.1.4 PLL 1 Divider Register
        5. 7.6.1.5 PLL 4 Charge Pump Current Control Register
        6. 7.6.1.6 Output Clock and TOF Control Register
        7. 7.6.1.7 TOF Configuration Registers
        8. 7.6.1.8 PLL 1, 2, 3 Charge Pump Current Control Registers
        9. 7.6.1.9 Reserved Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 148.35 MHz PLL Initialization Sequence
      2. 8.1.2 Enabling Genlock Mode
      3. 8.1.3 Output Disturbance While Output Alignment Mode Enabled
      4. 8.1.4 Evaluating the LMH1982
      5. 8.1.5 Input Reference
        1. 8.1.5.1 Reference Frame Decoder
      6. 8.1.6 Output Clocks and TOF
        1. 8.1.6.1 Programming the Output Clock Frequencies
        2. 8.1.6.2 Programming the Output Format Timing
          1. 8.1.6.2.1 Output TOF Clock
          2. 8.1.6.2.2 Output Frame Timing
            1. 8.1.6.2.2.1 HD Format TOF Generation Using a 27-MHz TOF Clock
          3. 8.1.6.2.3 Reference Frame Timing
          4. 8.1.6.2.4 Input-Output Frame Rate Ratio
          5. 8.1.6.2.5 Output Frame Line Offset
        3. 8.1.6.3 Programming the Output Initialization Sequence
          1. 8.1.6.3.1 TOF Output Delay Considerations
          2. 8.1.6.3.2 Output Clock Initialization Without TOF
        4. 8.1.6.4 Output Behavior Upon Loss Of Reference
      7. 8.1.7 Reference And Pll Lock Status
        1. 8.1.7.1 Reference Detection
          1. 8.1.7.1.1 Programming the Loss of Reference (LOR) Threshold
        2. 8.1.7.2 PLL Lock Detection
          1. 8.1.7.2.1 Programming the PLL Lock Threshold
          2. 8.1.7.2.2 PLL Lock Status Instability
      8. 8.1.8 Loop Response
        1. 8.1.8.1 Loop Response Design Equations
          1. 8.1.8.1.1 Loop Response Optimization Tips
          2. 8.1.8.1.2 Loop Filter Capacitors
        2. 8.1.8.2 Lock Time Considerations
        3. 8.1.8.3 VCXO Considerations
        4. 8.1.8.4 Free Run Output Jitter
    2. 8.2 Typical Applications
      1. 8.2.1 Analog Reference Genlock for Triple-Rate SDI Video
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Programming the PLL 1 Dividers
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Procedure for Designing the PLL 1 Dividers
      2. 8.2.2 SDI Reference Genlock for Triple-Rate SDI Video
      3. 8.2.3 Triple-Rate SDI Loop-through
      4. 8.2.4 Combined Genlock or Loop-Through for Triple-Rate SDI Video
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply Voltage, VDD 3.6 V
Supply Voltage, DVDD 2.75 V
Input Voltage (any input) −0.3 VDD +0.3 V
Lead Temperature (Soldering 10 sec.) 300 °C
Junction Temperature, TJMAX 150 °C
Storage Temperature −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine Model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD 3.135 3.465 V
DVDD 2.375 2.625 V
Input Voltage 0 VDD V
Temperature, TA 0 70 °C

6.4 Thermal Information

THERMAL METRIC(1) LMH1982 UNIT
RTV (WQFN)
32 PINS
RθJA Junction-to-ambient thermal resistance 33 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise specified, all limits are specified for TA = 25°C, VDD = 3.3 V, DVDD = 2.5 V.
PARAMETER TEST CONDITIONS MIN(2) TYP(1) MAX(2) UNIT
IVDD VDD Supply Current Default register settings, no input reference, 27-MHz VCXO and loop filter connected, 100-Ω differential load on SD_CLK and HD_CLK outputs; no load on all other outputs 47 mA
IDVDD DVDD Supply Current 39 mA
IVDD VDD Supply Current VDD = 3.465 V, DVDD = 2.625 V, Genlock mode, 1080p/59 output timing, HD_CLK = 148.35 MHz, SD_CLK = 67.5 MHz, 100-Ω differential load on SD_CLK and HD_CLK outputs; no load on all other outputs 57 mA
At the temperature extremes 70
IDVDD DVDD Supply Current 44 mA
At the temperature extremes 60
FREE RUN VOLTAGE CONTROL INPUT (PIN 1)
VIL Low Analog Input Voltage See (3) 0 V
VIH High Analog Input Voltage See  (3) VDD V
REFERENCE INPUTS (PINS 4, 5, 7, 8)
VIL Low Input Voltage IIN = ±10 μA 0 0.3 VDD V
VIH High Input Voltage IIN = ±10 µA 0.7 VDD VDD V
ΔTHV H-V Sync Timing Offset Input timing offset measured from H sync to V sync pulse leading edges (4) 2.0 μs
DIGITAL CONTROL INPUTS (PINS 6, 13, 14, 15)
VIL Low Input Voltage IIN = ±10 µA 0 0.3 VDD V
VIH High Input Voltage IIN = ±10 µA 0.7 VDD VDD V
I2C INTERFACE (PINS 11, 12)
VIL Low Input Voltage 0 0.3 VDD V
VIH High Input Voltage 0.7 VDD VDD V
IIN Input Current VIN between 0.1 VDD and 0.9 VDD −10 +10 μA
IOL Low Output Sink Current VOL = 0 V or 0.4 V 3 mA
STATUS FLAG OUTPUTS (PIN 16, 17)
VOL Low Output Voltage IOUT = +10 mA 0.4 V
VOH High Output Voltage IOUT = −10 mA VDD −0.4V V
TOP OF FRAME OUTPUT (PIN 25)
VOL Low Output Voltage IOUT = +10 mA 0.4 V
VOH High Output Voltage IOUT = −10 mA VDD −0.4V V
IOZ Output Hi-Z Leakage Current TOF output in Hi-Z mode, output pin connected to VDD or GND 0.4 10 |μA|
tR Rise Time 15-pF load 1.5 ns
tF Fall Time 15-pF load 1.5 ns
tD_TOF TOF Output Delay Time (5) Specified for any SD or HD format generated from 27-MHz TOF clock (6), outputs initialized (7), 15 pF load 2 ns
CLOCK OUTPUTS (PINS 19, 20, 23, 24)
JitterSD 27-MHz TIE Peak-to-Peak Output Jitter (8) HD_CLK = Hi-Z 23 ps
HD_CLK = 74.176 MHz 40 ps
67.5-MHz TIE Peak-to-Peak Output Jitter (8) HD_CLK = Hi-Z 40 ps
HD_CLK = 74.176 MHz 50 ps
JitterHD 74.176-MHz TIE Peak-to-Peak Output Jitter (8) SD_CLK = Hi-Z 55 ps
SD_CLK = 27 MHz 65 ps
74.25-MHz TIE Peak-to-Peak Output Jitter (8) SD_CLK = Hi-Z 40 ps
SD_CLK = 27 MHz 50 ps
148.35-MHz TIE Peak-to-Peak Output Jitter (8) SD_CLK = Hi-Z 60 ps
SD_CLK = 27 MHz 70 ps
148.5-MHz TIE Peak-to-Peak Output Jitter (8) SD_CLK = Hi-Z 45 ps
SD_CLK = 27 MHz 55 ps
tD_SD 27-MHz Output Delay Time (9) SD_CLK = 27 MHz, Any valid output timing, outputs initialized (7) 4 ns
67.5-MHz Output Delay Time (9) SD_CLK = 67.5 MHz, 525i output timing (6), outputs initialized (7) 6 ns
tD_HD 74.176-MHz Output Delay Time (10) HD_CLK = 74.176 MHz, 1080i/59 output timing (6), outputs initialized (7) 4.5 ns
74.25-MHz Output Delay Time (10) HD_CLK = 74.25 MHz, 1080i/50 output timing (6), outputs initialized (7) –0.6 ns
148.35-MHz Output Delay Time (10) HD_CLK = 148.35 MHz, 1080p/59 output timing (6), outputs initialized (7) 1.5 ns
148.5-MHz Output Delay Time (10) HD_CLK = 148.5 MHz, 1080p/50 output timing (6), outputs initialized (7) 4.5 ns
VOD Differential Signal Output Voltage (11) 100-Ω differential load 247 350 454 mV
VOS Common Signal Output Voltage (11) 100-Ω differential load 1.125 1.250 1.375 V
|VOD| |Change to VOD| for Complementary Output States (11) 100-Ω differential load 50 |mV|
|VOS| |Change to VOS| for Complementary Output States (11) 100-Ω differential load 50 |mV|
IOS Output Short Circuit Current Differential clock output pins connected to GND 24 |mA|
IOZ Output Hi-Z Leakage Current Output clock in Hi-Z mode, differential clock output pins connected to VDD or GND 1 10 |µA|
(1) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods.
(3) The input voltage to VC_FREERUN (pin 1) should also be within the input range of the external VCXO. The input voltage should be clean from noise that may significantly modulate the VCXO control voltage and consequently produce output jitter during free run operation.
(4) ΔTHV is a required specification that allows for proper frame decoding and subsequent output initialization (alignment). For interlace formats, the H-V sync timing offset must be within ΔTHV for all even fields and be outside ΔTHV for odd fields. For progressive formats, the H-V sync timing offset must be within ΔTHV for all frames. See sections Reference Frame Decoder and Output Frame Line Offset.
(5) tD_TOF is measured from the TOF pulse (leading negative edge) to the 27 MHz SD_CLK output (positive edge) using 50% levels.
(6) For any SD and HD output formats, the TOF pulse can be generated using 27 MHz as the TOF clock by programming TOF_CLK = 0, SD_FREQ = 0, and the alternative output counter values shown in Table 2. See HD Format TOF Generation Using a 27-MHz TOF Clock.
(7) Output initialization refers to the initial alignment of the output frame clock and TOF signals to the input reference frame. See Programming the Output Initialization Sequence.
(8) The SD and HD clock output jitter is based on VCXO clock (pin 29) with 20 ps peak-to-peak using a time interval error (TIE) jitter measurement. The typical TIE peak-to-peak jitter was measured on the LMH1982 evaluation bench board using TDSJIT3 jitter analysis software on a Tektronix DSA70604 oscilloscope and 1 GHz active differential probe.  TDSJIT3 Clock TIE Measurement Setup: 10-12 bit error rate (BER), >1 Meg samples recorded using multiple acquisitions Oscilloscope Setup: 20 mV/div vertical scale, 100 µs/div horizontal scale, and 25 GS/s sampling rate
(9) tD_SD is measured from the VCXO clock input (pin 29) to the SD_CLK output (pins 23, 24) using positive edges and 50% levels. The measurement is taken at the leading edge of the TOF pulse, where the input and output clocks are phase aligned at the start of frame.
(10) tD_HD is measured from the VCXO clock input (pin 29) to the HD_CLK output (pins 19, 20) using positive edges and 50% levels. The measurement is taken at the leading edge of the TOF pulse, where the input and output clocks are phase aligned at the start of frame.
(11) This parameter is specified for the SD_CLK output only. This parameter is ensured by design for the HD_CLK output.

6.6 Typical Characteristics

Test conditions: VDD = 3.3V, DVDD = 2.5V, Genlock mode, outputs initialized. H sync and V sync signals to REF_A inputs are from the LMH1981 sync separator, which receives an analog video reference signal from a Tektronix TG700 AVG7/AWVG7 (SD/HD) video signal generator. See the table notes below for register settings (in decimal):
LMH1982 30052433.gif
GNLK = 1, REF_DIV_SEL = 1, FB_DIV = 1716, SD_FREQ = 0, TOF_CLK = 0, TOF_PPL = 1716, TOF_LPFM = 525,
REF_LPFM = 525, TOF_OFFSET = 262; all other register settings are default
Figure 1. NTSC TOF Pulse
LMH1982 30052435.gif
GNLK = 1, REF_DIV_SEL = 1, FB_DIV = 960, SD_FREQ = 0,
HD_FREQ = 0, TOF_CLK = 0, TOF_PPL = 960,
TOF_LPFM = 1125, REF_LPFM = 1125, TOF_OFFSET = 562;
all other register settings are default
Figure 3. 1080i/50 TOF Pulse
LMH1982 30052431.gif
Figure 5. 525i TOF Output Delay Using 27 MHz TOF Clock
LMH1982 30052434.gif
GNLK = 1, REF_DIV_SEL = 1, FB_DIV = 1728, SD_FREQ = 0, TOF_CLK = 0, TOF_PPL = 1728, TOF_LPFM = 625,
REF_LPFM = 625, TOF_OFFSET = 312; all other register settings are default
Figure 2. PAL TOF Pulse
LMH1982 30052432.gif
GNLK = 1, REF_DIV_SEL = 1, FB_DIV = 1000, SD_FREQ = 0,
HD_FREQ = 0, TOF_CLK = 0, TOF_PPL = 1000,
TOF_LPFM = 1125, REF_LPFM = 1125, TOF_OFFSET = 1124; all other register settings are default
Figure 4. 1080p/24 TOF Pulse
LMH1982 30052430.gif
Figure 6. 1080i/50 TOF Output Delay Using 74.25 MHz TOF Clock