SNLS323N August   2010  – January 2017 LMH0395

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Switching Characteristics for SPI Interface
    8. 6.8 Timing Requirements for SPI Interface
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Mute Reference (MuteREF)
      2. 7.3.2 Carrier Detect (CD) and Mute
      3. 7.3.3 Input Interfacing
      4. 7.3.4 Output Interfacing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto Sleep
    5. 7.5 Programming
      1. 7.5.1 SPI Register Access
        1. 7.5.1.1  SPI Transaction Overview
        2. 7.5.1.2  SPI Write
        3. 7.5.1.3  SPI Read
        4. 7.5.1.4  SPI Daisy-Chain Operation
        5. 7.5.1.5  SPI Daisy-Chain Write
        6. 7.5.1.6  SPI Daisy-Chain Read
        7. 7.5.1.7  SPI Daisy-Chain Read and Write Example
        8. 7.5.1.8  SPI Daisy-Chain Length Detection
        9. 7.5.1.9  Output Driver Adjustments and De-Emphasis Setting
        10. 7.5.1.10 Launch Amplitude Optimization
        11. 7.5.1.11 Cable Length Indicator (CLI)
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Interfacing to 3.3-V SPI
      2. 8.1.2 Crosstalk Immunity
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Dos and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage 3.1 V
Input voltage (all inputs) -0.3 VCC+0.3 V
Junction temperature +125 °C
Storage temperature, Tstg -65 +150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±6000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC – VEE Supply voltage 2.375 2.5 2.625 V
Input coupling capacitance 1 µF
TA Operating free-air temperature -40 25 +85 °C

6.4 Thermal Information

THERMAL METRIC(1) LMH0395 UNIT
RTW (WQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 40 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 DC Electrical Characteristics

over operating free-air temperature range (unless otherwise noted).(1)(2)(3)(4)(5)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Input voltage high level Logic Inputs 1.7 VCC V
VIL Input voltage low level Logic Inputs VEE 0.7 V
VSDI Input voltage swing 0-m cable length(3) SDI 720 800 880 mVP−P
VCMIN Input common-mode voltage SDI or SDI 1.65 V
VSSP-P Differential output voltage, P-P SDO0, SDO0, SDO1, SDO1 (100-Ω load), default register settings (4) , Figure 1 500 700 900 mVP-P
VOD Differential output voltage 250 350 450 mV
ΔVOD Change in magnitude of VOD for complementary output states 50 mV
VOS Offset voltage 1.1 1.2 1.35 V
ΔVOS Change in magnitude of VOS for complementary output states 50 mV
IOS Output short circuit current 30 mA
MUTEREF MUTEREF DC voltage (floating) 1.3 V
MUTERNG MUTEREF range 0.8 V
VOH Output voltage high level CD, MISO, IOH = –2 mA 2 V
VOL Output voltage low level CD, MISO, IOL = +2 mA 0.2 V
ICC Supply current Normal operation, dual outputs(5) 55 78 mA
Normal operation, single output(5) 45 65 mA
Power-save mode 7 10 mA
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to VEE = 0 Volts.
(2) Typical values are stated for VCC = +2.5 V and TA = +25°C.
(3) The LMH0395 can be optimized for different launch amplitudes through the SPI.
(4) The differential output voltage and offset voltage are adjustable through the SPI.
(5) Typical ICC is measured with a 2.97-Gbps input signal.

6.6 AC Electrical Characteristics

over supply voltage and operating temperature ranges, unless otherwise specified(1).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BRMIN Minimum input data rate (SDI, SDI) 125 Mbps
BRMAX Maximum input data rate (SDI, SDI) 2970 Mbps
TJRAW Jitter for various cable lengths 2.97 Gbps, Belden 1694A,
0-100 meters(4)(6)		 0.2 UI
2.97 Gbps, Belden 1694A, 100-140 meters(4)(6) 0.3 UI
2.97 Gbps, Belden 1694A, 140-180 meters(4)(6) 0.5 UI
2.97 Gbps, Belden 1694A, 180-200 meters 0.55 UI
1.485 Gbps, Belden 1694A, 0-200 meters(4)(6) 0.2 UI
1.485 Gbps, Belden 1694A, 200-220 meters 0.3 UI
270 Mbps, Belden 1694A,
0-400 meters(4)(6)		 0.3 UI
tr, tf Output rise time, fall time (SDO0, SDO0, SDO1, SDO1) 20% – 80%, 100-Ω load, Figure 1(2) 90 130 ps
ΔTR-F Mismatch in rise/fall time (SDO0, SDO0, SDO1, SDO1) SDO0, SDO0, SDO1, SDO1See(2) 2 15 ps
tOS Output overshoot (SDO0, SDO0, SDO1, SDO1) 1% 5%
RLIN Input return loss (SDI, SDI) 5 MHz - 1.5 GHz(5) 15 dB
1.5 GHz - 3.0 GHz(5) 10 dB
RIN Input resistance (SDI, SDI,) Single-ended 1.5 kΩ
CIN Input capacitance (SDI, SDI) Single-ended 0.7 pF

6.7 Switching Characteristics for SPI Interface

over supply voltage and operating temperature ranges, unless otherwise specified (1).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tODZ MISO driven-to-tristate time MISO, see  Figure 3 20 ns
tOZD MISO tristate-to-driven time 10 ns
tOD MISO output delay time 15 ns
(1) Typical values are stated for VCC = +2.5 V and TA = +25°C.

6.8 Timing Requirements for SPI Interface

over supply voltage and operating temperature ranges, unless otherwise specified (1).
TEST CONDITIONS MIN NOM MAX UNIT
fSCK Frequency SCK 20 MHz
tPH SCK pulse width high SCK, see Figure 2, Figure 3 40 % SCK period
tPL SCK pulse width low 40 % SCK period
tSU MOSI set-up time MOSI, see Figure 2, Figure 3 4 ns
tH MOSI hold time 4 ns
tSSSU SS set-up time SS, see Figure 2, Figure 3 14 ns
tSSH SS hold time 4 ns
tSSOF SS OFF-time 1 SCK period
(1) Typical values are stated for VCC = +2.5 V and TA = +25°C.
(2) Specification is ensured by characterization.
(3) The LMH0395 can be optimized for different launch amplitudes through the SPI.
(4) Based on design and characterization data over the full range of recommended operating conditions of the device. Jitter is measured in accordance with ST RP 184, ST RP 192, and the applicable serial data transmission standard: ST 424, ST 292, or ST 259.
(5) Input return loss is dependent on board design. The LMH0395 exceeds this specification on the SD395EVK evaluation board with a return loss network consisting of a 5.6-nH inductor in parallel with a 75-Ω series resistor on the input.
(6) Due to SMPTE naming convention, all SMPTE Engineering Documents will be numbered as a two-letter prefix and a number. Documents and references with the same root number and year are functionally identical; for example ST 424-2006 and SMPTE 424M-2006 refer to the same document.
LMH0395 30115708.gif Figure 1. LVDS Output Voltage, Offset, and Timing Parameters
LMH0395 30115709.gif Figure 2. SPI Write
LMH0395 30115710.gif Figure 3. SPI Read

6.9 Typical Characteristics

LMH0395 2.97_Gbps_2m_curve.gif
Figure 4. Differential Serial Data Output After Equalizing 2 Meters of Belden 1694A at 2.97 Gbps, PRBS10
LMH0395 2.97_Gbps_170m_curve.gif
Figure 5. Differential Serial Data Output After Equalizing 170 Meters of Belden 1694A at 2.97 Gbps, PRBS10