SNLS323N August   2010  – January 2017 LMH0395

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Switching Characteristics for SPI Interface
    8. 6.8 Timing Requirements for SPI Interface
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Mute Reference (MuteREF)
      2. 7.3.2 Carrier Detect (CD) and Mute
      3. 7.3.3 Input Interfacing
      4. 7.3.4 Output Interfacing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto Sleep
    5. 7.5 Programming
      1. 7.5.1 SPI Register Access
        1. 7.5.1.1  SPI Transaction Overview
        2. 7.5.1.2  SPI Write
        3. 7.5.1.3  SPI Read
        4. 7.5.1.4  SPI Daisy-Chain Operation
        5. 7.5.1.5  SPI Daisy-Chain Write
        6. 7.5.1.6  SPI Daisy-Chain Read
        7. 7.5.1.7  SPI Daisy-Chain Read and Write Example
        8. 7.5.1.8  SPI Daisy-Chain Length Detection
        9. 7.5.1.9  Output Driver Adjustments and De-Emphasis Setting
        10. 7.5.1.10 Launch Amplitude Optimization
        11. 7.5.1.11 Cable Length Indicator (CLI)
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Interfacing to 3.3-V SPI
      2. 8.1.2 Crosstalk Immunity
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Dos and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

AN-1187 Leadless Leadframe Package (LLP) (SNOA401).

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.