ZHCSJC9G September   2006  – Jaunuary 2020 LM5069

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用图
  4. 修订历史记录
    1.     Device Comparison
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Circuit Breaker
      3. 7.3.3 Power Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Overvoltage Lockout (OVLO)
      6. 7.3.6 Power Good Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Up Sequence
      2. 7.4.2 Gate Control
      3. 7.4.3 Fault Timer and Restart
      4. 7.4.4 Shutdown Control
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 48-V, 10-A Hot Swap Design
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Select RSNS and CL setting
          2. 8.2.1.2.2 Selecting the Hot Swap FET(s)
          3. 8.2.1.2.3 Select Power Limit
          4. 8.2.1.2.4 Set Fault Timer
          5. 8.2.1.2.5 Check MOSFET SOA
          6. 8.2.1.2.6 Set Undervoltage and Overvoltage Threshold
            1. 8.2.1.2.6.1 Option A
            2. 8.2.1.2.6.2 Option B
            3. 8.2.1.2.6.3 Option C
            4. 8.2.1.2.6.4 Option D
          7. 8.2.1.2.7 Input and Output Protection
          8. 8.2.1.2.8 Final Schematic and Component Values
        3. 8.2.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PC Board Guidelines
      2. 10.1.2 System Considerations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

TJ = 25°C and VIN = 48 V (unless otherwise noted)
LM5069 20197203.gif
Figure 1. VIN Pin Input Current vs VIN
LM5069 20197205.gif
Figure 3. OUT Pin Current
LM5069 20197207.gif
Figure 5. GATE Pin Source Current vs VIN
LM5069 20197209.gif
Figure 7. MOSFET Power Dissipation Limit vs RPWR and RS
LM5069 20197255.gif
Figure 9. UVLO Hysteresis Current vs Temperature
LM5069 20197257.gif
Figure 11. UVLO, OVLO Threshold vs Temperature
LM5069 20197259.gif
Figure 13. Current Limit Threshold vs Temperature
LM5069 20197261.gif
Figure 15. Power Limit Threshold vs Temperature
LM5069 20197263.gif
Figure 17. GATE Source Current vs Temperature
LM5069 20197265.gif
Figure 19. PGD Low Voltage vs Temperature
LM5069 20197204.gif
Figure 2. SENSE Pin Input Current
LM5069 20197206.gif
Figure 4. GATE Pin Voltage vs VIN
LM5069 20197208.gif
Figure 6. PGD Pin Low Voltage vs Sink Current
LM5069 20197266.gif
Figure 8. GATE Pulldown Current, Circuit Breaker
vs GATE Voltage
LM5069 20197256.gif
Figure 10. OVLO Hysteresis Current vs Temperature
LM5069 20197258.gif
Figure 12. Input Current, Enabled vs Temperature
LM5069 20197260.gif
Figure 14. Circuit Breaker Threshold vs Temperature
LM5069 20197262.gif
Figure 16. GATE Output Voltage vs Temperature
LM5069 20197264.gif
Figure 18. GATE Pulldown Current, Circuit Breaker
vs Temperature