ZHCSCW5B August   2014  – September 2017 LM43600

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
    1.     5
    2.     辐射发射图VIN = 12V，VOUT = 3.3V，FSW= 500kHz，IOUT = 0.5A
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency Peak Current Mode Controlled Step-Down Regulator
      2. 8.3.2  Light Load Operation
      3. 8.3.3  Adjustable Output Voltage
      4. 8.3.4  Enable (ENABLE)
      5. 8.3.5  VCC, UVLO and BIAS
      6. 8.3.6  Soft Start and Voltage Tracking (SS/TRK)
      7. 8.3.7  Switching Frequency (RT) and Synchronization (SYNC)
      8. 8.3.8  Minimum ON-Time, Minimum OFF-Time and Frequency Foldback at Dropout Conditions
      9. 8.3.9  Internal Compensation and CFF
      10. 8.3.10 Bootstrap Voltage (BOOT)
      11. 8.3.11 Power Good (PGOOD)
      12. 8.3.12 Overcurrent and Short-Circuit Protection
      13. 8.3.13 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Stand-by Mode
      3. 8.4.3 Active Mode
      4. 8.4.4 CCM Mode
      5. 8.4.5 Light Load Operation
      6. 8.4.6 Self-Bias Mode
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Output Voltage Setpoint
        3. 9.2.2.3  Switching Frequency
        4. 9.2.2.4  Input Capacitors
        5. 9.2.2.5  Inductor Selection
        6. 9.2.2.6  Output Capacitor Selection
        7. 9.2.2.7  Feedforward Capacitor
        8. 9.2.2.8  Bootstrap Capacitors
        9. 9.2.2.9  VCC Capacitor
        10. 9.2.2.10 BIAS Capacitors
        11. 9.2.2.11 Soft-Start Capacitors
        12. 9.2.2.12 Undervoltage Lockout Setpoint
        13. 9.2.2.13 PGOOD
      3. 9.2.3 Application Performance Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Compact Layout for EMI Reduction
      2. 11.1.2 Ground Plane and Thermal Considerations
      3. 11.1.3 Feedback Resistors
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 开发支持
      1. 12.1.1 使用 WEBENCH® 工具创建定制设计
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.1.2 Ground Plane and Thermal Considerations

It is recommended to use one of the middle layers as a solid ground plane. Ground plane provides shielding for sensitive circuits and traces. It also provides a quiet reference potential for the control circuitry. The AGND and PGND pins should be connected to the ground plane using vias right next to the bypass capacitors. PGND pins are connected to the source of the internal LS switch. They should be connected directly to the grounds of the input and output capacitors. The PGND net contains noise at the switching frequency and may bounce due to load variations. The PGND trace, as well as PVIN and SW traces, should be constrained to one side of the ground plane. The other side of the ground plane contains much less noise and should be used for sensitive routes.

It is recommended to provide adequate device heat sinking by utilizing the PAD of the IC as the primary thermal path. Use a minimum 4 by 4 array of 10 mil thermal vias to connect the PAD to the system ground plane for heat sinking. The vias should be evenly distributed under the PAD. Use as much copper as possible for system ground plane on the top and bottom layers for the best heat dissipation. It is recommended to use a four-layer board with the copper thickness, for the four layers, starting from the top one, 2 oz / 1 oz / 1 oz / 2 oz. Four layer boards with enough copper thickness and proper layout provides low current conduction impedance, proper shielding and lower thermal resistance.

The thermal characteristics of the LM43600 are specified using the parameter RθJA, which characterize the junction temperature of the silicon to the ambient temperature in a specific system. Although the value of RθJA is dependant on many variables, it still can be used to approximate the operating junction temperature of the device. To obtain an estimate of the device junction temperature, one may use the following relationship:

Equation 25. TJ = PD× RθJA + TA

where

  • TJ = junction temperature in °C
  • PD = VIN × IIN × (1 − efficiency) − 1.1 × IOUT × DCR
  • RθJA = junction-to-ambient thermal resistance of the device in °C/W
  • TA = ambient temperature in °C.

The maximum operating junction temperature of the LM43600 is 125°C. RθJA is highly related to PCB size and layout, as well as enviromental factors such as heat sinking and air flow. Figure 107 shows measured results of RθJA with different copper area on a 2-layer board and a 4-layer board.

LM43600 C030_TjvsBoard_1A.pngFigure 107. Measured RθJA vs PCB Copper Area on a 2-layer Board and a 4-layer Board