ZHCSDN2 April   2015 LM3632A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements (SDA, SCL)
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Backlight
        1. 7.3.1.1 Brightness Control
          1. 7.3.1.1.1 LED Current with PWM Disabled
          2. 7.3.1.1.2 LED Current with PWM Enabled
        2. 7.3.1.2 Sloper
        3. 7.3.1.3 Mapper
        4. 7.3.1.4 PWM Input
        5. 7.3.1.5 PWM Minimum On/Off Time
        6. 7.3.1.6 PWM Resolution and Input Frequency Range
        7. 7.3.1.7 PWM Hysteresis
        8. 7.3.1.8 PWM Timeout
        9. 7.3.1.9 Backlight Boost Converter
          1. 7.3.1.9.1 Headroom Voltage
          2. 7.3.1.9.2 Backlight Protection and Faults
            1. 7.3.1.9.2.1 Overvoltage Protection (OVP) and Open-Load Fault Protection
            2. 7.3.1.9.2.2 Overcurrent Protection (OCP) and Overcurrent Protection Flag
      2. 7.3.2 LCM Bias
        1. 7.3.2.1 Display Bias Boost Converter (VVPOS, VVNEG)
        2. 7.3.2.2 Auto Sequence Mode
        3. 7.3.2.3 Wake-up Mode
        4. 7.3.2.4 Active Discharge
        5. 7.3.2.5 LCM Bias Protection and Faults
          1. 7.3.2.5.1 LCM Overvoltage Protection
          2. 7.3.2.5.2 VNEG Overvoltage Protection
          3. 7.3.2.5.3 VPOS Short Circuit Protection
          4. 7.3.2.5.4 VNEG Short Circuit Protection
      3. 7.3.3 Flash
        1. 7.3.3.1 Flash Boost Converter
        2. 7.3.3.2 Start-Up (Enabling The Device)
        3. 7.3.3.3 Pass Mode
        4. 7.3.3.4 Flash Mode
        5. 7.3.3.5 Torch Mode
        6. 7.3.3.6 Power Amplifier Synchronization (TX)
        7. 7.3.3.7 VIN Monitor
        8. 7.3.3.8 Flash Fault Protections
          1. 7.3.3.8.1 Fault Operation
          2. 7.3.3.8.2 Flash Time-Out
          3. 7.3.3.8.3 Overvoltage Protection (OVP)
          4. 7.3.3.8.4 Current Limit
          5. 7.3.3.8.5 FLED and/or FL_OUT Short Fault
      4. 7.3.4 Software RESET
      5. 7.3.5 EN Input
      6. 7.3.6 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Serial Bus Interface
        1. 7.5.1.1 Interface Bus Overview
        2. 7.5.1.2 Data Transactions
        3. 7.5.1.3 Acknowledge Cycle
        4. 7.5.1.4 Acknowledge After Every Byte Rule
        5. 7.5.1.5 Addressing Transfer Formats
    6. 7.6 Register Maps
      1. 7.6.1  Revision (Address = 0x01) [reset = 0x05]
      2. 7.6.2  Backlight Configuration1 (Address = 0x02) [reset = 0x30]
      3. 7.6.3  Backlight Configuration2 (Address = 0x03) [reset = 0x0D]
      4. 7.6.4  Backlight Brightness LSB (Address = 0x04) [reset = 0x07]
      5. 7.6.5  Backlight Brightness MSB (Address = 0x05) [reset = 0xFF]
      6. 7.6.6  Flash/Torch Current (Address = 0x06) [reset = 0x3E]
      7. 7.6.7  Flash Configuration (Address = 0x07) [reset = 0x2F]
      8. 7.6.8  VIN Monitor (Address = 0x08) [reset = 0x03]
      9. 7.6.9  I/O Control (Address = 0x09) [reset = 0x00]
      10. 7.6.10 Enable (Address = 0x0A) [reset = 0x00]
      11. 7.6.11 Flags1 (Address = 0x0B) [reset = 0x00]
      12. 7.6.12 Display Bias Configuration (Address = 0x0C) [reset = 0x18]
      13. 7.6.13 LCM Boost Bias (Address = 0x0D) [reset = 0x1E]
      14. 7.6.14 VPOS Bias (Address = 0x0E) [reset = 0x1E]
      15. 7.6.15 VNEG Bias (Address = 0x0F) [reset = 0x1C]
      16. 7.6.16 Flags2 (Address = 0x10) [reset = 0x00]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Components
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Boost Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Backlight Curves
        2. 8.2.3.2 LCM Bias Curves
        3. 8.2.3.3 Flash Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

YFF Package
30-Pin DSBGA
Top View
LM3632A 30pin_dsbga_top_view.gif

Pin Functions

PIN TYPE DESCRIPTION
NUMBER NAME
A1 VPOS O Positive LDO output for LCM bias power
A2 LCM_OUT O LCM bias boost output voltage
A3 LCM_SW O LCM bias boost switch connection
A4 BL_GND - Backlight boost ground connection
A5 BL_SW O Backlight boost switch connection
B1 LCM_EN2 I Enable for inverting charge pump output
B2 LCM_EN1 I Enable for positive LDO output
B3 EN I Active high chip enable
B4 LCM_GND - LCM bias boost ground connection
B5 BL_OUT O Backlight boost output voltage
C1 C1 O Inverting charge pump flying capacitor positive connection
C2 SDA I/O Serial data connection for I2C- compatible interface
C3 TX I Flash interrupt input
C4 AGND - Analog ground connection
C5 BLED1 O Input pin to internal LED current sink 1
D1 CP_GND - Inverting charge pump ground connection
D2 SCL I Serial clock connection for I2C- compatible interface
D3 STROBE I Flash enable input
D4 PWM I PWM input for CABC current control
D5 BLED2 O Input pin to internal LED current sink 2
E1 C2 O Inverting charge pump flying capacitor negative connection
E2 FLED O High-side current source output for flash LED
E3 FL_OUT O Flash boost output voltage
E4 FL_SW O Flash boost switch connection
E5 VIN I Input voltage connection
F1 VNEG O Inverting charge pump output voltage
F2 FLED O High-side current source output for flash LED
F3 FL_OUT O Flash boost output voltage
F4 FL_SW O Flash boost switch connection
F5 FL_GND - Flash boost ground connection