ZHCSDN2 April   2015 LM3632A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements (SDA, SCL)
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Backlight
        1. 7.3.1.1 Brightness Control
          1. 7.3.1.1.1 LED Current with PWM Disabled
          2. 7.3.1.1.2 LED Current with PWM Enabled
        2. 7.3.1.2 Sloper
        3. 7.3.1.3 Mapper
        4. 7.3.1.4 PWM Input
        5. 7.3.1.5 PWM Minimum On/Off Time
        6. 7.3.1.6 PWM Resolution and Input Frequency Range
        7. 7.3.1.7 PWM Hysteresis
        8. 7.3.1.8 PWM Timeout
        9. 7.3.1.9 Backlight Boost Converter
          1. 7.3.1.9.1 Headroom Voltage
          2. 7.3.1.9.2 Backlight Protection and Faults
            1. 7.3.1.9.2.1 Overvoltage Protection (OVP) and Open-Load Fault Protection
            2. 7.3.1.9.2.2 Overcurrent Protection (OCP) and Overcurrent Protection Flag
      2. 7.3.2 LCM Bias
        1. 7.3.2.1 Display Bias Boost Converter (VVPOS, VVNEG)
        2. 7.3.2.2 Auto Sequence Mode
        3. 7.3.2.3 Wake-up Mode
        4. 7.3.2.4 Active Discharge
        5. 7.3.2.5 LCM Bias Protection and Faults
          1. 7.3.2.5.1 LCM Overvoltage Protection
          2. 7.3.2.5.2 VNEG Overvoltage Protection
          3. 7.3.2.5.3 VPOS Short Circuit Protection
          4. 7.3.2.5.4 VNEG Short Circuit Protection
      3. 7.3.3 Flash
        1. 7.3.3.1 Flash Boost Converter
        2. 7.3.3.2 Start-Up (Enabling The Device)
        3. 7.3.3.3 Pass Mode
        4. 7.3.3.4 Flash Mode
        5. 7.3.3.5 Torch Mode
        6. 7.3.3.6 Power Amplifier Synchronization (TX)
        7. 7.3.3.7 VIN Monitor
        8. 7.3.3.8 Flash Fault Protections
          1. 7.3.3.8.1 Fault Operation
          2. 7.3.3.8.2 Flash Time-Out
          3. 7.3.3.8.3 Overvoltage Protection (OVP)
          4. 7.3.3.8.4 Current Limit
          5. 7.3.3.8.5 FLED and/or FL_OUT Short Fault
      4. 7.3.4 Software RESET
      5. 7.3.5 EN Input
      6. 7.3.6 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Serial Bus Interface
        1. 7.5.1.1 Interface Bus Overview
        2. 7.5.1.2 Data Transactions
        3. 7.5.1.3 Acknowledge Cycle
        4. 7.5.1.4 Acknowledge After Every Byte Rule
        5. 7.5.1.5 Addressing Transfer Formats
    6. 7.6 Register Maps
      1. 7.6.1  Revision (Address = 0x01) [reset = 0x05]
      2. 7.6.2  Backlight Configuration1 (Address = 0x02) [reset = 0x30]
      3. 7.6.3  Backlight Configuration2 (Address = 0x03) [reset = 0x0D]
      4. 7.6.4  Backlight Brightness LSB (Address = 0x04) [reset = 0x07]
      5. 7.6.5  Backlight Brightness MSB (Address = 0x05) [reset = 0xFF]
      6. 7.6.6  Flash/Torch Current (Address = 0x06) [reset = 0x3E]
      7. 7.6.7  Flash Configuration (Address = 0x07) [reset = 0x2F]
      8. 7.6.8  VIN Monitor (Address = 0x08) [reset = 0x03]
      9. 7.6.9  I/O Control (Address = 0x09) [reset = 0x00]
      10. 7.6.10 Enable (Address = 0x0A) [reset = 0x00]
      11. 7.6.11 Flags1 (Address = 0x0B) [reset = 0x00]
      12. 7.6.12 Display Bias Configuration (Address = 0x0C) [reset = 0x18]
      13. 7.6.13 LCM Boost Bias (Address = 0x0D) [reset = 0x1E]
      14. 7.6.14 VPOS Bias (Address = 0x0E) [reset = 0x1E]
      15. 7.6.15 VNEG Bias (Address = 0x0F) [reset = 0x1C]
      16. 7.6.16 Flags2 (Address = 0x10) [reset = 0x00]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Components
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Boost Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Backlight Curves
        2. 8.2.3.2 LCM Bias Curves
        3. 8.2.3.3 Flash Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类产品或服务单独或与任何 TI 产品或服务一起的表示或认可。

11.2 文档支持

11.2.1 相关文档

相关文档如下：

德州仪器 (TI) 应用手册 AN1112：《DSBGA 晶圆级芯片规模封装》（文献编号：SNVA009）。

《了解开关模式电源中的升压功率级》，

http://focus.ti.com/lit/an/slva061/slva061.pdf。

《Power Stage Designer™ 工具》， http://www.ti.com.cn/tool/cn/powerstage-designer。

11.3 商标

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.5 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。