ZHCSLI5 September   2020 LM34966-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Line Undervoltage Lockout (UVLO/SYNC/EN Pin)
      2. 8.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 8.3.3  Soft Start (SS Pin)
      4. 8.3.4  Switching Frequency (RT Pin)
      5. 8.3.5  Clock Synchronization (UVLO/SYNC/EN Pin)
      6. 8.3.6  Current Sense and Slope Compensation (CS Pin)
      7. 8.3.7  Current Limit and Minimum On-time (CS Pin)
      8. 8.3.8  Feedback and Error Amplifier (FB, COMP Pin)
      9. 8.3.9  Power-Good Indicator (PGOOD Pin)
      10. 8.3.10 Hiccup Mode Overload Protection
      11. 8.3.11 Maximum Duty Cycle Limit and Minimum Input Supply Voltage
      12. 8.3.12 MOSFET Driver (GATE Pin)
      13. 8.3.13 Overvoltage Protection (OVP)
      14. 8.3.14 Thermal Shutdown (TSD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Run Mode
  9. 9 Application and Implementation
    1. 9.1 Power-On Hours (POH)
    2. 9.2 Application Information
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Custom Design With WEBENCH® Tools
        2. 9.3.2.2 Recommended Components
        3. 9.3.2.3 Inductor Selection (LM)
        4. 9.3.2.4 Output Capacitor (COUT)
        5. 9.3.2.5 Input Capacitor
        6. 9.3.2.6 MOSFET Selection
        7. 9.3.2.7 Diode Selection
        8. 9.3.2.8 Efficiency Estimation
      3. 9.3.3 Application Curve
    4. 9.4 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.1 Power-On Hours (POH)

The device is capable of operating at a wide temperature range including high junction temperature up to 150°C. It is designed to meet or exceed AEC-Q100 grade 1 specifications by accommodating additional IC junction temperature rise while operating at 125°C ambient temperature. The electrical specifications of the device is fully characterized between TJ of -40°C to 150°C to support automotive and other high junction temperature applications. Extended reliability test data beyond AEC-Q100 grade 1 specification is also available upon request.

The device is capable of supporting product lifetime operation temperature profiles typical to many automotive applications. Table 9-1 shows an example of an application with 19340 POH at an input bias voltage of 40 V. The life span of a semiconductor device is a function of bias conditions, operating temperatures, and power-on time. Extended operation at high junction temperature degrades the product total power-on hours.

Table 9-1 POH Breakdown
JUNCTION TEMPERATURE POWER-ON HOURS DISTRIBUTION OPERATING CONDITIONS
-15°C 720 Hours 3.7%

BIAS = 40 V

Ea = 0.7eV
48°C 6300 Hours 32.6%
101°C 11000 Hours 56.9%
145°C 1200 Hours 6.2%
150°C 120 Hours 0.6%