ZHCST92 October   2023 ISOTMP35-Q1

ADVANCE INFORMATION  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 Revision History
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Insulation Specification
   6. 6.6 Electrical Characteristics
   7. 6.7 Typical Characteristics
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Features Description
      1. 7.3.1 Integrated Isolation Barrier and Thermal Response
      2. 7.3.2 Analog Output
      3. 7.3.3 Thermal Response
   4. 7.4 Device Functional Modes
9. 8 Application and Implementation
   1. 8.1 Application Information
      1. 8.1.1 Output Voltage Linearity
      2. 8.1.2 Load Regulation
      3. 8.1.3 Start-Up Settling Time
      4. 8.1.4 Thermal Response
      5. 8.1.5 External Buffer
      6. 8.1.6 ADC Selection and Impact on Accuracy
      7. 8.1.7 Implementation Guidelines
      8. 8.1.8 PSRR
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Insulation Lifetime
   3. 8.3 Power Supply Recommendations
   4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
       1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information