ZHCSJ25C November   2018  – October 2022 ISO7760-Q1 , ISO7761-Q1 , ISO7762-Q1 , ISO7763-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Electrical Characteristics—2.5-V Supply
    14. 7.14 Supply Current Characteristics—2.5-V Supply
    15. 7.15 Switching Characteristics—5-V Supply
    16. 7.16 Switching Characteristics—3.3-V Supply
    17. 7.17 Switching Characteristics—2.5-V Supply
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
      1.      Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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7.8 Safety Limiting Values

Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DW-16 PACKAGE
ISSafety input, output, or supply current(1)RθJA = 60.3 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C,
see Figure 7-1		377mA
RθJA = 60.3 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C,
see Figure 7-1		576
RθJA = 60.3 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C,
see Figure 7-1		754
PSSafety input, output, or total power(1)RθJA = 60.3 °C/W, TJ = 150°C, TA = 25°C, see Figure 7-32073mW
TSMaximum safety temperature(1)150°C
DBQ-16 PACKAGE
ISSafety input, output, or supply current(1)RθJA = 86.5 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C,
see Figure 7-2		263mA
RθJA = 86.5 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C,
see Figure 7-2		401
RθJA = 86.5 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C,
see Figure 7-2		525
PSSafety input, output, or total power(1)RθJA = 86.5 °C/W, TJ = 150°C, TA = 25°C, see Figure 7-41445mW
TSMaximum safety temperature(1)150°C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.
 
The junction-to-air thermal resistance, RθJA, in the Section 7.4 table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
 
TJ = TA + RθJA × P, where P is the power dissipated in the device.
 
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
 
PS = IS × VI, where VI is the maximum input voltage.