ZHCSE09B
June 2015 – March 2024
HD3SS3411-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements
5.7
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Output Enable and Power Savings
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
AC Coupling Capacitors
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.1.1
Critical Routes
7.4.1.2
General Routing/Placement Rules
7.4.2
Layout Example
8
Device and Documentation Support
8.1
接收文档更新通知
8.2
支持资源
8.3
Trademarks
8.4
静电放电警告
8.5
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RWA|14
MPQF435A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcse09b_oa
zhcse09b_pm
8.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。