ZHCSDQ8 April   2015 HD3SS2522

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adaptive Common Mode Tracking for USB 3.1 MUX
      2. 8.3.2 DFP-to-UFP Attach/Detach Detection
      3. 8.3.3 Plug Orientation/Cable Twist Detection
      4. 8.3.4 VBUS Fault
      5. 8.3.5 VCONN Fault
    4. 8.4 Device Functional Modes
      1. 8.4.1 Unattached.DFP State
      2. 8.4.2 Attached.DFP State
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 USB Type-C DFP Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 USB Type-C Current Advertising
        2. 9.2.2.2 VCONN and VBUS Power Switch Control
        3. 9.2.2.3 Firmware Upgradability
      3. 9.2.3 USB Type-C DFP Circuit Schematics with a Type C Receptacle
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Critical Routes
      2. 11.1.2 General Routing/Placement Rules
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 商标

All trademarks are the property of their respective owners.

12.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.3 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。