ZHCSNT9K
July 2008 – March 2021
DRV8800
,
DRV8801
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
Logic Inputs
8.3.2
VREG (DRV8800 Only)
8.3.3
VPROPI (DRV8801 Only)
8.3.3.1
Connecting VPROPI Output to ADC
8.3.4
Charge Pump
8.3.5
Shutdown
8.3.6
Low-Power Mode
8.3.7
Braking
8.3.8
Diagnostic Output
8.3.9
Thermal Shutdown (TSD)
8.3.10
Overcurrent Protection
8.3.11
SENSE
8.4
Device Functional Modes
8.4.1
Device Operation
8.4.1.1
Slow-Decay SR (Brake Mode)
8.4.1.2
Fast Decay With Synchronous Rectification
8.4.1.2.1
34
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Motor Voltage
9.2.2.2
Power Dissipation
9.2.2.3
Thermal Considerations
9.2.2.3.1
Junction-to-Ambiant Thermal Impedance (ƟJA)
9.2.2.4
Motor Current Trip Point
9.2.2.5
Sense Resistor Selection
9.2.2.6
Drive Current
9.2.3
Pulse-Width Modulating
9.2.3.1
Pulse-Width Modulating ENABLE
9.2.3.2
Pulse-Width Modulating PHASE
9.2.4
Application Curves
9.3
Parallel Configuration
9.3.1
Parallel Connections
9.3.2
Non – Parallel Connections
9.3.3
Wiring nFAULT as Wired OR
9.3.4
Electrical Considerations
9.3.4.1
Device Spacing
9.3.4.2
Recirculation Current Handling
9.3.4.3
Sense Resistor Selection
9.3.4.4
Maximum System Current
10
Power Supply Recommendations
10.1
Bulk Capacitance
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Related Links
12.2
Trademarks
12.3
静电放电警告
12.4
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
PWP|16
MPDS371A
RTY|16
MPQF170A
散热焊盘机械数据 (封装 | 引脚)
PWP|16
PPTD153P
RTY|16
QFND060D
订购信息
zhcsnt9k_oa
zhcsnt9k_pm
12.3
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。