ZHCSPF5 April   2022 DRV8300-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings AUTO
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Three BLDC Gate Drivers
        1. 8.3.1.1 Gate Drive Timings
          1. 8.3.1.1.1 Propagation Delay
          2. 8.3.1.1.2 Deadtime and Cross-Conduction Prevention
        2. 8.3.1.2 Gate Driver Outputs
      2. 8.3.2 Pin Diagrams
      3. 8.3.3 Gate Driver Protective Circuits
        1. 8.3.3.1 VBSTx Undervoltage Lockout (BSTUV)
        2. 8.3.3.2 GVDD Undervoltage Lockout (GVDDUV)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Bootstrap Capacitor and GVDD Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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7.4 Thermal Information

THERMAL METRIC (1) DRV8300-Q1 UNIT
PW (TSSOP)
20  PINS
RθJA Junction-to-ambient thermal resistance 97.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.3 °C/W
RθJB Junction-to-board thermal resistance 48.8 °C/W
ΨJT Junction-to-top characterization parameter 4.3 °C/W
ΨJB Junction-to-board characterization parameter 48.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.