ZHCSCM1F July   2014  – November 2020 DLPC3430 , DLPC3435

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Test Pins and General Control
    2. 5.2 Parallel Port Input
    3. 5.3 DSI Input Data and Clock
    4. 5.4 DMD Reset and Bias Control
    5. 5.5 DMD Sub-LVDS Interface
    6. 5.6 Peripheral Interface
    7. 5.7 GPIO Peripheral Interface
    8. 5.8 Clock and PLL Support
    9. 5.9 Power and Ground
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 BT656 Interface General Timing Requirements
    15. 6.15 DSI Host Timing Requirements
    16. 6.16 Flash Interface Timing Requirements
    17. 6.17 Other Timing Requirements
    18. 6.18 DMD Sub-LVDS Interface Switching Characteristics
    19. 6.19 DMD Parking Switching Characteristics
    20. 6.20 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 3D Display
        3. 7.3.1.3 Parallel Interface
          1. 7.3.1.3.1 PDATA Bus – Parallel Interface Bit Mapping Modes
        4. 7.3.1.4 DSI Interface
      2. 7.3.2 Device Startup
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  PLL Power Layout
      2. 10.1.2  Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3  DSI Interface Layout
      4. 10.1.4  Unused Pins
      5. 10.1.5  DMD Control and Sub-LVDS Signals
      6. 10.1.6  Layer Changes
      7. 10.1.7  Stubs
      8. 10.1.8  Terminations
      9. 10.1.9  Routing Vias
      10. 10.1.10 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 接收文档更新通知
    5. 11.5 支持资源
    6. 11.6 Trademarks
    7. 11.7 静电放电警告
    8. 11.8 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

6.5 Power Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER(4)(5)(6)TEST CONDITIONSMINTYP(1)MAX(2)UNIT
I(VDD) + I(VDD_PLLM) + I(VDD_PLLD)1.1V railsFrame rate = 60 Hz111160mA
Frame rate = 120 Hz132196
Frame rate = 240 Hz179295
I(VDD_PLLM)MCG PLL 1.1-V current(3)Frame rate = 60 Hz6mA
Frame rate = 120 Hz6
Frame rate = 240 Hz6
I(VDD_PLLD)DCG PLL 1.1-V current(3)Frame rate = 60 Hz6mA
Frame rate = 120 Hz6
Frame rate = 240 Hz6
I(VCC18)All 1.8-V I/O current: (1.8-V power supply for all I/O other than the host or parallel interface and the SPI flash interface)Frame rate = 60 Hz2736mA
Frame rate = 120 Hz2736
Frame rate = 240 Hz2736
I(VCC_INTF)Host or parallel interface I/O current: 1.8 to 3.3 V (includes IIC0, PDATA, video syncs, and HOST_IRQ pins)(3)Frame rate = 60 Hz2mA
Frame rate = 120 Hz2
Frame rate = 240 Hz2
I(VCC_FLSH)Flash interface I/O current:1.8 to 3.3 V(3)Frame rate = 60 Hz1mA
Frame rate = 120 Hz1
Frame rate = 240 Hz1
(1) If measured on a system, typical PVT (process, voltage, and temperature) conditions (i.e. nominal process, typical voltage, and 25°C nominal ambient temperature) and various input images were used.
(2) Measured on a system with worst case PVT condition(s) (i.e. corner process, high voltage, and high temperature of 65°C) and white noise input image.
(3) This rail was not measured due to board limitations. Simulation values are used instead. Simulations assume 12.5% activity factor, 30% clock gating on appropriate domains, and mixed SVT (standard threshold voltage) or HVT (high threshold voltage) cells.
(4) For the measured cases, all pins using 1.1 V were tied together (including VDDLP12), and programmable host and flash I/O are at the minimum nominal voltage (that is 1.8 V).
(5) Input image is 854 × 480 (WVGA) 24-bits using reduced VESA timings on the parallel interface at the frame rate shown with the 0.2-inch WVGA (DLP2010) DMD. The controller has the CAIC and LABB algorithms turned off.
(6) The measured values do not take into account software updates or customer changes that may affect power performance.