ZHCSN34B November   2017  – November 2024 DLP650LE

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Capacitance at Recommended Operating Conditions
    8. 5.8  Timing Requirements
    9. 5.9  Window Characteristics
    10. 5.10 System Mounting Interface Loads
    11. 5.11 Micromirror Array Physical Characteristics
    12. 5.12 Micromirror Array Optical Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. 9 Device and Documentation Support
    1. 9.1 第三方产品免责声明
    2. 9.2 Device Support
      1. 9.2.1 Device Nomenclature
      2. 9.2.2 Device Markings
    3. 9.3 Documentation Support
      1. 9.3.1 Related Documentation
    4. 9.4 接收文档更新通知
    5. 9.5 支持资源
    6. 9.6 Trademarks
    7. 9.7 静电放电警告
    8. 9.8 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision A (February 2023) to Revision B (November 2024)

  • 更新了 DLP650LE 的链接Go
  • 通篇将主控制器更新为 DLPC4420Go
  • 更新了简化版应用图来表示非融合器件Go
  • 添加了 DLPC4420 作为支持的显示控制器Go
  • 添加了 DLP 产品第三方搜索工具链接，以及 TI DLP 显示技术入门链接Go
  • Updated notes to reflect non-fusion deviceGo
  • Expanded and updated table Micromirror Array Optical CharacteristicsGo
  • Updated Function Block Diagram.Go
  • Updated controller to DLPC4420Go
  • Changed Micromirror Array Temperature CalculationGo
  • Added section Micromirror Power Density Calculation.Go
  • Updated Figure to reflect non-fusion deviceGo
  • Updated controller to DLPC4420Go
  • Updated section to reflect non-fusion deviceGo
  • Updated Figure and corrected comments from non-fusion related to fusion related. Also removed Transition Points and Delay Timing Requirements tables.Go
  • Added link to DLPC4420 data sheetGo

Changes from Revision * (November 2017) to Revision A (February 2023)

  • 将文档状态从“预告信息”更改为“量产数据”Go
  • 更新了整个文档中的表格、图和交叉参考的编号格式将控制器更新为 DLPC4430。更新了芯片组元件的链接Go
  • 将控制器更新为 DLPC4430Go
  • Updated controller to DLPC4430Go
  • Updated controller to DLPC4430Go
  • Added a table for legacy part numbers and listed the mechanical ICDGo
  • Updated controller to DLPC4430Go
  • Updated controller to DLPC4430Go
  • Updated controller to DLPC4430Go
  • Updated controller to DLPC4430, updated the linksGo