ZHCSL02C March   2020  – March 2023 DLP3021-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Application Mission Profile Consideration
  9. Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 Device Handling
    8. 11.8 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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Micromirror Array Temperature Calculation

Active array temperature can be computed analytically from measurement points on the outside of the package, the package thermal resistance, the electrical power, and the illumination heat load.

Relationship between array temperature and the reference ceramic temperature (thermocouple location TP1 in Figure 7-8) is provided by the following equations.

Equation 1. TARRAY = TCERAMIC + (QARRAY × RARRAY-TO-CERAMIC)
Equation 2. QARRAY = QELECTRICAL + QILLUMINATION

where

  • TARRAY = computed DMD array temperature (°C)
  • TCERAMIC = measured ceramic temperature (TP1 location in Figure 7-8) (°C)
  • RARRAY-TO-CERAMIC = DMD package thermal resistance from array to TP1 (°C/watt) (see Section 6.5)
  • QARRAY = total power, electrical plus absorbed, on the DMD array (watts)
  • QELECTRICAL = nominal electrical power dissipation by the DMD (watts)
  • QILLUMINATION = (CL2W × SL)
  • CL2W = conversion constant for screen lumens to power on the DMD (watts/lumen)
  • SL = measured screen lumens (lm)

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating frequencies.

Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source.

Equations shown previous are valid for a 1-Chip DMD system with total projection efficiency from DMD to the screen of 87%.

The constant CL2W is based on the DMD array characteristics. It assumes a spectral efficiency of 300 lumens/watt for the projected light and illumination distribution of 83.7% on the active array, and 16.3% on the array border.

Sample calculation:

  • SL = 50 lm
  • CL2W = 0.00293 W/lm
  • QELECTRICAL = 0.162 W
  • RARRAY-TO-CERAMIC = 7.0°C/W
  • TCERAMIC = 55°C
    Equation 3. QARRAY = 0.162 W + (0.00293 × 50 lm) = 0.309 W
    Equation 4. TARRAY = 55°C + (0.309 W × 7.0°C/W) = 57.2°C
GUID-DD2D9D39-C38F-495E-9143-4E3E22E60E72-low.gifFigure 7-8 Thermocouple Location