ZHCSL02C
March 2020 – March 2023
DLP3021-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
Switching Characteristics
6.9
System Mounting Interface Loads
6.10
Physical Characteristics of the Micromirror Array
6.11
Micromirror Array Optical Characteristics
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Micromirror Array
7.3.2
Double Data Rate (DDR) Interface
7.3.3
Micromirror Switching Control
7.3.4
DMD Voltage Supplies
7.3.5
Logic Reset
7.3.6
Temperature Sensing Diode
7.3.6.1
Temperature Sense Diode Theory
7.3.7
DMD JTAG Interface
7.4
System Optical Considerations
7.4.1
Numerical Aperture and Stray Light Control
7.4.2
Pupil Match
7.4.3
Illumination Overfill and Alignment
7.5
DMD Image Performance Specification
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.3
Application Mission Profile Consideration
9
Power Supply Recommendations
9.1
Power Supply Sequencing Requirements
9.1.1
Power Up and Power Down
10
Layout
10.1
Layout Guidelines
10.2
Temperature Diode Pins
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.1.2
Device Markings
11.2
Documentation Support
11.2.1
Related Documentation
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
Device Handling
11.8
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FQR|54
MCCC009
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsl02c_oa
11.8
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。