ZHCSL02C
March 2020 – March 2023
DLP3021-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
Switching Characteristics
6.9
System Mounting Interface Loads
6.10
Physical Characteristics of the Micromirror Array
6.11
Micromirror Array Optical Characteristics
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Micromirror Array
7.3.2
Double Data Rate (DDR) Interface
7.3.3
Micromirror Switching Control
7.3.4
DMD Voltage Supplies
7.3.5
Logic Reset
7.3.6
Temperature Sensing Diode
7.3.6.1
Temperature Sense Diode Theory
7.3.7
DMD JTAG Interface
7.4
System Optical Considerations
7.4.1
Numerical Aperture and Stray Light Control
7.4.2
Pupil Match
7.4.3
Illumination Overfill and Alignment
7.5
DMD Image Performance Specification
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.3
Application Mission Profile Consideration
9
Power Supply Recommendations
9.1
Power Supply Sequencing Requirements
9.1.1
Power Up and Power Down
10
Layout
10.1
Layout Guidelines
10.2
Temperature Diode Pins
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.1.2
Device Markings
11.2
Documentation Support
11.2.1
Related Documentation
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
Device Handling
11.8
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FQR|54
MCCC009
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsl02c_oa
11.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。