ZHCSAY2F March   2013  – March 2015 CSD87381P

PRODUCTION DATA.  

  1. 1特性
  2. 2应用范围
  3. 3说明
  4. 4修订历史记录
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Power Block Performance
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Power Block Characteristics
    7. 5.7 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Power Loss Curves
      2. 6.1.2 Safe Operating Curves (SOA)
      3. 6.1.3 Normalized Curves
      4. 6.1.4 Calculating Power Loss and SOA
        1. 6.1.4.1 Design Example
        2. 6.1.4.2 Calculating Power Loss
        3. 6.1.4.3 Calculating SOA Adjustments
  7. 7Layout
    1. 7.1 Layout Guidelines
      1. 7.1.1 Recommended PCB Design Overview
      2. 7.1.2 Electrical Performance
      3. 7.1.3 Thermal Performance
    2. 7.2 Layout Example
  8. 8器件和文档支持
    1. 8.1 商标
    2. 8.2 静电放电警告
    3. 8.3 术语表
  9. 9机械、封装和可订购信息
    1. 9.1 CSD87381P 封装尺寸
    2. 9.2 焊盘布局建议
    3. 9.3 模板建议 (100µm)
    4. 9.4 模板建议 (125µm)
    5. 9.5 引脚图
    6. 9.6 CSD87381P 压纹载带尺寸

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from E Revision (June 2014) to F Revision

Changes from D Revision (May 2014) to E Revision

  • 将“无铅引脚镀层”特性更改成了“无铅”Go

Changes from C Revision (January 2014) to D Revision

  • 更新了数据表以反映新标准Go
  • 已更正器件尺寸 Go

Changes from B Revision (May 2013) to C Revision

  • 更新了标题Go
  • 已添加小卷带信息Go
  • Added unit to test condition in Electrical CharacteristicsGo
  • Added a link for Figure 29 in Electrical PerformanceGo

Changes from A Revision (March 2013) to B Revision

  • Changed RθJC-PCB To: RθJC in the Thermal Information tableGo
  • Changed Figure 15Go

Changes from * Revision (March 2013) to A Revision

  • 更改了产品预览器件 Go