ZHCSU29E August 2009 – December 2023 CSD16321Q5
PRODUCTION DATA
4.2 Thermal Information
TA = 25°C (unless otherwise stated)
| PARAMETER | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| R θJC | Junction-to-case thermal resistance(1) | 1.1 | °C/W | ||
| R θJA | Junction-to-ambient thermal resistance(1) (2) | 50 | °C/W | ||
(1) RθJC is determined with the device mounted on a 1-in2, 2-oz Cu pad on a 1.5-in × 1.5-in, 0.06-in thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board design.
(2) Device mounted on FR4 Material with 1 in2 of 2-oz Cu.
|
Max RθJA = 50°C/W when mounted on 1 in2 of 2-oz Cu. |
|
Max RθJA = 125°C/W when mounted on minimum pad area of 2-oz Cu. |