ZHCSUO2E April   2004  – February 2024 CDCVF2509

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5.   Pin Configuration and Functions
  6. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Dissipation Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Package Thermal Resistance
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
    7. 4.7 Switching Characteristics
    8. 4.8 Typical Characteristics
  7. 5Parameter Measurement Information
  8. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 支持资源
    3. 6.3 Trademarks
    4. 6.4 静电放电警告
    5. 6.5 术语表
  9. 7Revision History
  10. 8Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

4.4 Package Thermal Resistance

CDCVF2509APW 24-PIN TSSOP(1) THERMAL AIRFLOW (CFM) UNIT
0 150 250 500
RθJA High K 88 83 81 77 °C/W
RθJC High K 26.5
(1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).