ZHCSJL6C August   1998  – March 2023 CD4051B-Q1 , CD4053B-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - CD4051B-Q1
    6. 6.6 AC Performance Characteristics - CD4051B-Q1
    7. 6.7 Electrical Characteristics - CD4053B-Q1
    8. 6.8 AC Performance Characteristics - CD4053B-Q1
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) CD405xB-Q1 UNIT
D (SOIC) PW (TSSOP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance  86.7 116.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.3 47.2 °C/W
RθJB Junction-to-board thermal resistance 45.3 63.0 °C/W
ΨJT Junction-to-top characterization parameter 12.1 6.4 °C/W
ΨJB Junction-to-board characterization parameter 44.9 62.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.