ZHCSOT4B February   2020  – May 2021 CC3230S , CC3230SF

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. 功能方框图
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Pin Descriptions
    3. 7.3 Signal Descriptions
      1.     
    4. 7.4 Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Device, Before Reset Release
    7. 7.7 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary (CC3230S)
      1.     
    6. 8.6  Current Consumption Summary (CC3230SF)
      1.     
    7. 8.7  TX Power Control
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for GPIO Pins
      1. 8.9.1 Electrical Characteristics: GPIO Pins Except 29, 30, 50, 52, and 53
      2. 8.9.2 Electrical Characteristics: GPIO Pins 29, 30, 50, 52, and 53
    10. 8.10 Electrical Characteristics for Pin Internal Pullup and Pulldown
      1.     
    11. 8.11 WLAN Receiver Characteristics
      1.     
    12. 8.12 WLAN Transmitter Characteristics
      1.     
    13. 8.13 WLAN Transmitter Out-of-Band Emissions
      1. 8.13.1 WLAN Filter Requirements
    14. 8.14 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    15. 8.15 Thermal Resistance Characteristics for RGK Package
    16. 8.16 Timing and Switching Characteristics
      1. 8.16.1 Power Supply Sequencing
      2. 8.16.2 Device Reset
      3. 8.16.3 Reset Timing
        1. 8.16.3.1 nRESET (32-kHz Crystal)
        2. 8.16.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.16.3.3 nRESET (External 32-kHz Clock)
          1. 8.16.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Clock)
      4. 8.16.4 Wakeup From HIBERNATE Mode
      5. 8.16.5 Clock Specifications
        1. 8.16.5.1 Slow Clock Using Internal Oscillator
        2. 8.16.5.2 Slow Clock Using an External Clock
          1. 8.16.5.2.1 External RTC Digital Clock Requirements
        3. 8.16.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.16.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.16.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.16.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.16.6 Peripherals Timing
        1. 8.16.6.1  SPI
          1. 8.16.6.1.1 SPI Master
            1. 8.16.6.1.1.1 SPI Master Timing Parameters
          2. 8.16.6.1.2 SPI Slave
            1. 8.16.6.1.2.1 SPI Slave Timing Parameters
        2. 8.16.6.2  I2S
          1. 8.16.6.2.1 I2S Transmit Mode
            1. 8.16.6.2.1.1 I2S Transmit Mode Timing Parameters
          2. 8.16.6.2.2 I2S Receive Mode
            1. 8.16.6.2.2.1 I2S Receive Mode Timing Parameters
        3. 8.16.6.3  GPIOs
          1. 8.16.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 8.16.6.3.1.1 GPIO Output Transition Times (Vsupply = 3.3 V) (1) (1)
          2. 8.16.6.3.2 GPIO Input Transition Time Parameters
            1. 8.16.6.3.2.1 GPIO Input Transition Time Parameters
        4. 8.16.6.4  I2C
          1. 8.16.6.4.1 I2C Timing Parameters (1)
        5. 8.16.6.5  IEEE 1149.1 JTAG
          1. 8.16.6.5.1 JTAG Timing Parameters
        6. 8.16.6.6  ADC
          1. 8.16.6.6.1 ADC Electrical Specifications
        7. 8.16.6.7  Camera Parallel Port
          1. 8.16.6.7.1 Camera Parallel Port Timing Parameters
        8. 8.16.6.8  UART
        9. 8.16.6.9  SD Host
        10. 8.16.6.10 Timers
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  Power-Management Subsystem
    6. 9.6  Low-Power Operating Mode
    7. 9.7  Memory
      1. 9.7.1 External Memory Requirements
      2. 9.7.2 Internal Memory
        1. 9.7.2.1 SRAM
        2. 9.7.2.2 ROM
        3. 9.7.2.3 Flash Memory
        4. 9.7.2.4 Memory Map
    8. 9.8  Restoring Factory Default Configuration
    9. 9.9  Boot Modes
      1. 9.9.1 Boot Mode List
    10. 9.10 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1 第三方产品免责声明
    2. 11.2 Tools and Software
    3. 11.3 Firmware Updates
    4. 11.4 Device Nomenclature
    5. 11.5 Documentation Support
    6. 11.6 支持资源
    7. 11.7 Trademarks
    8. 11.8 静电放电警告
    9. 11.9 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 多核心架构,片上系统 (SoC)
  • 多层安全特性可帮助开发人员保护身份信息、数据和软件 IP
  • 低功耗模式适用于电池供电应用
  • 与 BLE 无线电共存 (CC13x2/CC26x2)
  • 网络辅助漫游
  • 工业温度:–40°C 至 +85°C
  • 获得 Wi-Fi Alliance®Wi-Fi CERTIFIED®
  • 应用微控制器子系统:
    • ®运行频率为 80 MHz 的 Arm®Cortex®-M4 内核
    • 用户专用存储器
      • 256KB RAM
      • 可选的 1MB 可执行文件闪存
    • 多种外设和计时器
    • 27 个带灵活多路复用选项的 I/O 引脚
      • UART、I2S、I2C、SPI、SD、ADC,
        8 位并行接口
      • 计时器和 PWM
  • Wi-Fi 网络处理器子系统
    • Wi-Fi® 内核:
      • 802.11b/g/n 2.4GHz
      • 模式:
        • 接入点 (AP)
        • 基站 (STA)
        • Wi-Fi Direct®
      • 安全性:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 企业
        • WPA3™ 个人版
        • WPA3™ 企业版
    • 互联网和应用协议:
      • HTTP 服务器、mDNS、DNS-SD 和 DHCP
      • IPv4 和 IPv6 TCP/IP 堆栈
      • 16 BSD 套接字(完全安全的 TLS v1.2 和 SSL 3.0)
    • 内置的电源管理子系统:
      • 可配置的低功耗配置(始终、间歇性、标签)
      • 高级低功耗模式
      • 集成式直流/直流稳压器
  • 多层安全特性
    • 独立执行环境
    • 网络安全
    • 设备身份和密钥
    • 硬件加速器加密引擎(AES、DES、SHA/MD5 和 CRC)
    • 应用级安全(加密、身份验证、访问控制)
    • 初始安全编程
    • 软件篡改检测
    • 安全引导
    • 证书注册请求 (CSR)
    • 每个设备具有唯一密钥对
  • 应用吞吐量:
    • UDP:16Mbps,TCP:13Mbps
    • 峰值:72Mbps
  • 电源管理子系统:
    • 集成式直流/直流转换器支持宽电源电压范围:
      • VBAT 宽电压模式:2.1 V 至 3.6 V
      • VIO 始终与 VBAT 关联
    • 高级低功耗模式:
      • 关断:1µA,休眠:4.5µA
      • 低功耗深度睡眠 (LPDS):120µA
      • 空闲连接(MCU 处于 LPDS 状态):710µA
      • RX 流量(MCU 处于活动模式):59 mA
      • TX 流量(MCU 处于活动模式):223 mA
  • Wi-Fi TX 功率:
    • 1 DSSS 时为 18.0dBm
    • 54OFDM 时为 14.5dBm
  • Wi-Fi RX 灵敏度:
    • 1 DSSS 时为 -96dBm
    • 54 OFDM 时为 -74.5dBm
  • 时钟源:
    • 具有内部振荡器的 40.0MHz 晶体
    • 32.768kHz 晶体或外部 RTC
  • RGK 封装
    • 64 引脚 9mm × 9mm 极薄四方扁平无引线 (VQFN) 封装,0.5mm 间距
  • 器件支持 SimpleLink™ MCU 平台开发人员生态系统