ZHCSFF6D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

1. 1 器件概述
   1. 1.1 特性
   2. 1.2 应用
   3. 1.3 说明
   4. 1.4 功能框图
2. 2 修订历史记录
3. 3 Device Comparison
   1. 3.1 Related Products
4. 4 Terminal Configuration and Functions
   1. 4.1 Module Pin Diagram
   2. 4.2 Pin Functions
5. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Power Consumption Summary
   5. 5.5  General Characteristics
   6. 5.6  Antenna
   7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
   8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
   9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
   10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
   11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
   12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
   13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
   14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
   15. 5.15 ADC Characteristics
   16. 5.16 Temperature Sensor
   17. 5.17 Battery Monitor
   18. 5.18 Continuous Time Comparator
   19. 5.19 Low-Power Clocked Comparator
   20. 5.20 Programmable Current Source
   21. 5.21 DC Characteristics
   22. 5.22 Thermal Resistance Characteristics for MOH Package
   23. 5.23 Timing Requirements
   24. 5.24 Switching Characteristics
   25. 5.25 Typical Characteristics
6. 6 Detailed Description
   1. 6.1  Overview
   2. 6.2  Functional Block Diagram
   3. 6.3  Main CPU
   4. 6.4  RF Core
   5. 6.5  Sensor Controller
   6. 6.6  Memory
   7. 6.7  Debug
   8. 6.8  Power Management
   9. 6.9  Clock Systems
   10. 6.10 General Peripherals and Modules
   11. 6.11 System Architecture
   12. 6.12 Certification
       1. 6.12.1 Regulatory Information Europe
       2. 6.12.2 Federal Communications Commission Statement
       3. 6.12.3 Canada, Industry Canada (IC)
       4. 6.12.4 Japan (JATE ID)
   13. 6.13 End Product Labeling
   14. 6.14 Manual Information to the End User
   15. 6.15 Module Marking
7. 7 Application, Implementation, and Layout
   1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
   2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
8. 8 Environmental Requirements and Specifications
   1. 8.1 PCB Bending
   2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
   3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
   4. 8.4 Baking Conditions
   5. 8.5 Soldering and Reflow Condition
9. 9 器件和文档支持
   1. 9.1  器件命名规则
   2. 9.2  工具和软件
   3. 9.3  文档支持
   4. 9.4  德州仪器 (TI) 低功耗射频网站
   5. 9.5  低功耗射频电子新闻简报
   6. 9.6  社区资源
   7. 9.7  其他信息
   8. 9.8  商标
   9. 9.9  静电放电警告
   10. 9.10 Export Control Notice
   11. 9.11 Glossary
10. 10机械、封装和可订购信息
    1. 10.1 封装信息
    2. 10.2 PACKAGE OPTION ADDENDUM
       1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
       1. 10.3.1 TAPE AND REEL INFORMATION