ZHCSFF6D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

  1. 1 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2 修订历史记录
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Module Pin Diagram
    2. 4.2 Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  Antenna
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
    8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
    9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
    10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
    11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
    12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
    13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
    14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
    15. 5.15 ADC Characteristics
    16. 5.16 Temperature Sensor
    17. 5.17 Battery Monitor
    18. 5.18 Continuous Time Comparator
    19. 5.19 Low-Power Clocked Comparator
    20. 5.20 Programmable Current Source
    21. 5.21 DC Characteristics
    22. 5.22 Thermal Resistance Characteristics for MOH Package
    23. 5.23 Timing Requirements
    24. 5.24 Switching Characteristics
    25. 5.25 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 System Architecture
    12. 6.12 Certification
      1. 6.12.1 Regulatory Information Europe
      2. 6.12.2 Federal Communications Commission Statement
      3. 6.12.3 Canada, Industry Canada (IC)
      4. 6.12.4 Japan (JATE ID)
    13. 6.13 End Product Labeling
    14. 6.14 Manual Information to the End User
    15. 6.15 Module Marking
  7. 7 Application, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  8. 8 Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. 9 器件和文档支持
    1. 9.1  器件命名规则
    2. 9.2  工具和软件
    3. 9.3  文档支持
    4. 9.4  德州仪器 (TI) 低功耗射频网站
    5. 9.5  低功耗射频电子新闻简报
    6. 9.6  社区资源
    7. 9.7  其他信息
    8. 9.8  商标
    9. 9.9  静电放电警告
    10. 9.10 Export Control Notice
    11. 9.11 Glossary
  10. 10机械、封装和可订购信息
    1. 10.1 封装信息
    2. 10.2 PACKAGE OPTION ADDENDUM
      1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
      1. 10.3.1 TAPE AND REEL INFORMATION

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOH|29
散热焊盘机械数据 (封装 | 引脚)
订购信息

4.2 Pin Functions

Table 4-1 describes the CC2650MODA pins.

Table 4-1 Signal Descriptions – MOH Package

PIN NAME PIN NO. PIN TYPE DESCRIPTION
DIO_0 4 Digital I/O GPIO, Sensor Controller
DIO_1 5 Digital I/O GPIO, Sensor Controller
DIO_2 6 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_3 7 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_4 8 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_5/JTAG_TDO 11 Digital I/O GPIO, high-drive capability, JTAG_TDO
DIO_6/JTAG_TDI 12 Digital I/O GPIO, high-drive capability, JTAG_TDI
DIO_7 14 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
DIO_8 15 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
DIO_9 16 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
DIO_10 17 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
DIO_11 18 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
DIO_12 19 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
DIO_13 20 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
DIO_14 21 Digital I/O, Analog I/O GPIO, Sensor Controller, analog
EGP G1, G2, G3, G4 Power Ground – Exposed ground pad
GND 1, 3, 25 — Ground
JTAG_TCK 10 Digital I/O JTAG TCKC
JTAG_TMS 9 Digital I/O JTAG TMSC, high-drive capability
NC 2, 24 NC Not Connected—TI recommends leaving these pins floating
nRESET 13 Digital input Reset, active low. No internal pullup
VDD 22, 23 Power 1.8-V to 3.8-V main chip supply