ZHCSFF6D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

  1. 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 修订历史记录
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 Module Pin Diagram
    2. 4.2 Pin Functions
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  Antenna
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
    8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
    9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
    10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
    11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
    12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
    13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
    14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
    15. 5.15 ADC Characteristics
    16. 5.16 Temperature Sensor
    17. 5.17 Battery Monitor
    18. 5.18 Continuous Time Comparator
    19. 5.19 Low-Power Clocked Comparator
    20. 5.20 Programmable Current Source
    21. 5.21 DC Characteristics
    22. 5.22 Thermal Resistance Characteristics for MOH Package
    23. 5.23 Timing Requirements
    24. 5.24 Switching Characteristics
    25. 5.25 Typical Characteristics
  6. Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 System Architecture
    12. 6.12 Certification
      1. 6.12.1 Regulatory Information Europe
      2. 6.12.2 Federal Communications Commission Statement
      3. 6.12.3 Canada, Industry Canada (IC)
      4. 6.12.4 Japan (JATE ID)
    13. 6.13 End Product Labeling
    14. 6.14 Manual Information to the End User
    15. 6.15 Module Marking
  7. Application, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  8. Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. 器件和文档支持
    1. 9.1  器件命名规则
    2. 9.2  工具和软件
    3. 9.3  文档支持
    4. 9.4  德州仪器 (TI) 低功耗射频网站
    5. 9.5  低功耗射频电子新闻简报
    6. 9.6  社区资源
    7. 9.7  其他信息
    8. 9.8  商标
    9. 9.9  静电放电警告
    10. 9.10 Export Control Notice
    11. 9.11 Glossary
  10. 10机械、封装和可订购信息
    1. 10.1 封装信息
    2. 10.2 PACKAGE OPTION ADDENDUM
      1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
      1. 10.3.1 TAPE AND REEL INFORMATION

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOH|29
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted.
CC2650MODA D004_SWRS187.gifFigure 5-4 Bluetooth low energy Sensitivity vs Temperature
CC2650MODA D006_SWRS187.gifFigure 5-6 Bluetooth low energy Sensitivity
vs Supply Voltage (VDD)
CC2650MODA D008_SWRS187.gifFigure 5-8 IEEE 802.15.4 Sensitivity
vs Channel Frequency
CC2650MODA D010_SWRS187.gifFigure 5-10 TX Output Power vs Temperature
CC2650MODA D012_SWRS187.gifFigure 5-12 TX Output Power
vs Channel Frequency
CC2650MODA D014_SWRS187.gifFigure 5-14 RX Mode Current vs Supply Voltage (VDD)
CC2650MODA D016_SWRS187.gifFigure 5-16 TX Mode Current Consumption vs Temperature
CC2650MODA D007_SWRS158.gifFigure 5-18 Active Mode (MCU Running, No Peripherals)
Current Consumption vs Supply Voltage (VDD)
CC2650MODA D009_SWRS158.gifFigure 5-20 SoC ADC Effective Number of Bits vs Input Frequency (Internal Reference)
CC2650MODA D013_SWRS158.gifFigure 5-22 SoC ADC Output vs Temperature (Fixed Input, Internal Reference)
CC2650MODA D005_SWRS187.gifFigure 5-5 IEEE 802.15.4 Sensitivity vs Temperature
CC2650MODA D007_SWRS187.gifFigure 5-7 IEEE 802.15.4 Sensitivity
vs Supply Voltage (VDD)
CC2650MODA D009_SWRS187.gifFigure 5-9 Bluetooth low energy Sensitivity
vs Channel Frequency
CC2650MODA D011_SWRS187.gifFigure 5-11 TX Output Power vs Supply Voltage (VDD)
CC2650MODA D013_SWRS187.gifFigure 5-13 TX Current Consumption
vs Supply Voltage (VDD)
CC2650MODA D015_SWRS187.gifFigure 5-15 RX Mode Current Consumption vs Temperature
CC2650MODA D006_SWRS158.gifFigure 5-17 Active Mode (MCU Running, No Peripherals)
Current Consumption vs Temperature
CC2650MODA D008_SWRS158.gifFigure 5-19 Standby Mode Current Consumption
With RCOSC RTC vs Temperature
CC2650MODA D012_SWRS158.gifFigure 5-21 SoC ADC Output vs Supply Voltage (Fixed Input, Internal Reference)
CC2650MODA D009A_SWRS158.gifFigure 5-23 SoC ADC ENOB vs Sampling Frequency
(Input Frequency = FS / 10)
CC2650MODA D010_SWRS158.gifFigure 5-24 SoC ADC DNL vs ADC Code (Internal Reference)
CC2650MODA D011_SWRS158.gifFigure 5-25 SoC ADC INL vs ADC Code (Internal Reference)