ZHCSEJ8B January   2011  – December 2015

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: General Purpose I/O
    6. 7.6  Supply Current
    7. 7.7  REG27 LDO
    8. 7.8  Coulomb Counter
    9. 7.9  ADC
    10. 7.10 External Capacitor Voltage Balance Drive
    11. 7.11 Capacitor Voltage Monitor
    12. 7.12 Internal Temperature Sensor
    13. 7.13 Thermistor Measurement Support
    14. 7.14 Internal Thermal Shutdown
    15. 7.15 High-Frequency Oscillator
    16. 7.16 Low-Frequency Oscillator
    17. 7.17 RAM Backup
    18. 7.18 Flash
    19. 7.19 Current Protection Thresholds
    20. 7.20 Current Protection Timing
    21. 7.21 Timing Requirements: SMBus
    22. 7.22 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Super Capacitor Measurements
        1. 8.1.1.1 Voltage
        2. 8.1.1.2 Current, Charge and Discharge Counting
        3. 8.1.1.3 Device Calibration
        4. 8.1.1.4 Temperature
        5. 8.1.1.5 Series Capacitor Configuration
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Capacitance Monitoring and Learning
        1. 8.3.1.1 Monitoring and Control Operational Overview
        2. 8.3.1.2 Main Monitoring Registers
        3. 8.3.1.3 Initial Capacitance at Device Reset
        4. 8.3.1.4 Qualified Capacitance Learning
        5. 8.3.1.5 Health Determination
        6. 8.3.1.6 ESR Measurement
        7. 8.3.1.7 Monitor Operating Modes
      2. 8.3.2 Capacitor Voltage Balancing
      3. 8.3.3 Charge Control
        1. 8.3.3.1 Charge Termination
        2. 8.3.3.2 CHG Over Ride Control
      4. 8.3.4 Lifetime Data Gathering
        1. 8.3.4.1 Lifetime Maximum Temperature
        2. 8.3.4.2 Lifetime Minimum Temperature
        3. 8.3.4.3 Lifetime Maximum Capacitor Voltage
      5. 8.3.5 Safety Detection Features
        1. 8.3.5.1  Capacitor Overvoltage (OV)
        2. 8.3.5.2  Capacitor Voltage Imbalance (CIM)
        3. 8.3.5.3  Weak Capacitor (CLBAD)
        4. 8.3.5.4  Overtemperature (OT)
        5. 8.3.5.5  Overcurrent During Charging (OC Chg)
        6. 8.3.5.6  Overcurrent During Discharging (OC Dsg)
        7. 8.3.5.7  Short-Circuit During Charging (SC Chg)
        8. 8.3.5.8  Short-Circuit During Discharging (SC Dsg)
        9. 8.3.5.9  AFE Watchdog (WDF)
        10. 8.3.5.10 Integrated AFE Communication Fault (AFE_C)
        11. 8.3.5.11 Data Flash Fault (DFF)
        12. 8.3.5.12 FAULT Indication (FAULT Pin)
      6. 8.3.6 Communications
        1. 8.3.6.1 SMBus On and Off State
      7. 8.3.7 Security (Enables and Disables Features)
      8. 8.3.8 Measurement System Calibration
        1. 8.3.8.1  Coulomb Counter Deadband
        2. 8.3.8.2  Auto Calibration
        3. 8.3.8.3  Current Gain
        4. 8.3.8.4  CC Delta
        5. 8.3.8.5  Cap1 K-factor
        6. 8.3.8.6  Cap2 K-factor
        7. 8.3.8.7  Cap3 K-factor
        8. 8.3.8.8  Cap4 K-factor
        9. 8.3.8.9  Cap5 K-factor
        10. 8.3.8.10 K-factor Override Flag
        11. 8.3.8.11 System Voltage K-factor
        12. 8.3.8.12 Stack Voltage K-factor
        13. 8.3.8.13 K-factor Stack Override Flag
        14. 8.3.8.14 CC Offset
        15. 8.3.8.15 Board Offset
        16. 8.3.8.16 Int Temp Offset
        17. 8.3.8.17 Ext1 Temp Offset
        18. 8.3.8.18 CC Current
        19. 8.3.8.19 Voltage Signal
        20. 8.3.8.20 Temp Signal
        21. 8.3.8.21 CC Offset Time
        22. 8.3.8.22 ADC Offset Time
        23. 8.3.8.23 Current Gain Time
        24. 8.3.8.24 Voltage Time
        25. 8.3.8.25 Temperature Time
        26. 8.3.8.26 Cal Mode Timeout
        27. 8.3.8.27 Ext Coef a1..a5, b1..b4, Ext rc0, Ext adc0
        28. 8.3.8.28 Rpad
        29. 8.3.8.29 Rint
        30. 8.3.8.30 Int Coef 1..4, Int Min AD, Int Max Temp
        31. 8.3.8.31 Filter
        32. 8.3.8.32 Deadband
        33. 8.3.8.33 CC Deadband
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Power Modes
    5. 8.5 Programming
      1. 8.5.1 Communications
        1. 8.5.1.1 bq33100 Slave Address
        2. 8.5.1.2 SMBus On and Off State
        3. 8.5.1.3 Packet Error Checking
      2. 8.5.2 SBS Commands
        1. 8.5.2.1 SBS Command Summary
        2. 8.5.2.2 SBS Command Details
          1. 8.5.2.2.1  ManufacturerAccess (0x00)
            1. 8.5.2.2.1.1  Device Type (0x0001)
            2. 8.5.2.2.1.2  Firmware Version (0x0002)
            3. 8.5.2.2.1.3  Hardware Version (0x0003)
            4. 8.5.2.2.1.4  DF Checksum (0x0004)
            5. 8.5.2.2.1.5  Seal Device (0x0020)
            6. 8.5.2.2.1.6  Lifetime and Capacitor Balancing Enable (0x0021)
            7. 8.5.2.2.1.7  FAULT Activation (0x0030)
            8. 8.5.2.2.1.8  FAULT Clear (0x0031)
            9. 8.5.2.2.1.9  CHGLVL0 Activation (0x0032)
            10. 8.5.2.2.1.10 CHGLVL0 Clear (0x0033)
            11. 8.5.2.2.1.11 CHGLVL1 Activation (0x0033)
            12. 8.5.2.2.1.12 CHGLVL1 Clear (0x0034)
            13. 8.5.2.2.1.13 Learn Load Activation (0x0037)
            14. 8.5.2.2.1.14 Learn Load Clear (0x0038)
            15. 8.5.2.2.1.15 Calibration Mode (0x0040)
            16. 8.5.2.2.1.16 Reset (0x0041)
            17. 8.5.2.2.1.17 Unseal Device (UnsealKey)
            18. 8.5.2.2.1.18 Extended SBS Commands
          2. 8.5.2.2.2  Temperature (0x08)
          3. 8.5.2.2.3  Voltage (0x09)
          4. 8.5.2.2.4  Current (0x0a)
          5. 8.5.2.2.5  ESR (0x0b)
          6. 8.5.2.2.6  RelativeStateofCharge (0x0d)
          7. 8.5.2.2.7  Health (0x0e)
          8. 8.5.2.2.8  Capacitance (0x10)
          9. 8.5.2.2.9  ChargingCurrent (0x14)
          10. 8.5.2.2.10 ChargingVoltage (0x15)
          11. 8.5.2.2.11 CapacitorVoltage5..1 (0x3b..0x3f)
          12. 8.5.2.2.12 Extended SBS Commands
            1. 8.5.2.2.12.1 FETControl(0x46)
            2. 8.5.2.2.12.2 SafetyAlert (0x50)
            3. 8.5.2.2.12.3 SafetyStatus (0x51)
            4. 8.5.2.2.12.4 OperationStatus (0x54)
            5. 8.5.2.2.12.5 SystemVoltage (0x5a)
            6. 8.5.2.2.12.6 UnSealKey(0x60)
            7. 8.5.2.2.12.7 ManufacturerInfo(0x70)
      3. 8.5.3 Data Flash
        1. 8.5.3.1 Accessing Data Flash
        2. 8.5.3.2 Data Flash Interface
        3. 8.5.3.3 Data Flash Summary
        4. 8.5.3.4 Specific Data Flash Programming Details
          1. 8.5.3.4.1  OC Dsg
          2. 8.5.3.4.2  OC Dsg Time
          3. 8.5.3.4.3  SC Dsg Cfg
          4. 8.5.3.4.4  SC Chg Cfg
          5. 8.5.3.4.5  Initial Full Charge Capacitance
          6. 8.5.3.4.6  Full Charge Capacitance
          7. 8.5.3.4.7  Firmware Version
          8. 8.5.3.4.8  Hardware Revision
          9. 8.5.3.4.9  Manuf. Info
          10. 8.5.3.4.10 Operation Cfg
          11. 8.5.3.4.11 FET ACTION
          12. 8.5.3.4.12 FAULT
          13. 8.5.3.4.13 AFE State_CTL
          14. 8.5.3.4.14 Measurement Margin %
          15. 8.5.3.4.15 Timer
          16. 8.5.3.4.16 V Chg Nominal
          17. 8.5.3.4.17 V Chg A
          18. 8.5.3.4.18 V Chg B
          19. 8.5.3.4.19 V Chg Max
          20. 8.5.3.4.20 Min Voltage
          21. 8.5.3.4.21 Learning Frequency
          22. 8.5.3.4.22 Dsg Current Threshold
          23. 8.5.3.4.23 Chg Current Threshold
          24. 8.5.3.4.24 Quit Current
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting Number of Series Capacitor Support
        2. 9.2.2.2 Selecting Charging Voltage Values
        3. 9.2.2.3 Learning Frequency Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • 全集成超级电容管理器，适用于 2、3、4 或 5 个电容串联
  • 在不提供单独电容监视和均衡功能的前提下，可与多达 9 个串联的电容搭配使用
  • 有源电容电压均衡
    • 防止超级电容在充电过程中发生过压
  • 电容健康状况监视
    • 电容学习
    • 等效串联电阻 (ESR) 测量
    • 运行状态
    • 充电状态
    • 健康状况
    • 充电电压和电流报告
    • 带可选引脚指示的安全报警
  • 集成保护监控
    • 过压
    • 短路
    • 过热
    • 过量电容泄漏
  • 2 线 SMBus 串行通信
  • 高精度 16 位 Σ-Δ ADC，通过 16 通道多路复用器进行测量
    • 用于电压、电流和温度
  • 低功耗
    • < 660µA（正常运行模式）
    • <1µA（关断模式）
  • 宽运行温度范围：–40°C 至 +85°C

2 应用

  • 备用电池的替代产品
  • 缓存控制器
  • RAID 系统
  • 刀锋服务器卡
  • 不间断电源 (UPS)
  • 医疗与测试设备
  • 便携式仪器

3 说明

德州仪器 (TI) 的 bq33100 超级电容管理器是一款全集成单片解决方案，其提供有丰富的充电控制、监视和保护 功能， 不仅可为 2、3、4 或 5 个串联超级电容提供单独电容监视与均衡功能，还能够为多达 9 个串联电容提供电池组电压测量。bq33100 采用紧凑型 7.8mm × 6.4mm 24 引脚薄型小外形尺寸 (TSSOP) 封装，最大限度丰富功能和提高安全性的同时，还为超级电容应用极大地改善了易用性、削减了解决方案成本并减小了解决方案 尺寸。

器件信息(1)

器件型号 封装 封装尺寸（标称值）
bq33100 TSSOP (24) 7.80mm × 4.40mm
  1. 要了解所有可用封装，请参见数据表末尾的可订购产品附录。

bq33100 系统图

bq33100 system_diagram_SLUS987.gif