ZHCSEJ8B January   2011  – December 2015

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: General Purpose I/O
    6. 7.6  Supply Current
    7. 7.7  REG27 LDO
    8. 7.8  Coulomb Counter
    9. 7.9  ADC
    10. 7.10 External Capacitor Voltage Balance Drive
    11. 7.11 Capacitor Voltage Monitor
    12. 7.12 Internal Temperature Sensor
    13. 7.13 Thermistor Measurement Support
    14. 7.14 Internal Thermal Shutdown
    15. 7.15 High-Frequency Oscillator
    16. 7.16 Low-Frequency Oscillator
    17. 7.17 RAM Backup
    18. 7.18 Flash
    19. 7.19 Current Protection Thresholds
    20. 7.20 Current Protection Timing
    21. 7.21 Timing Requirements: SMBus
    22. 7.22 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Super Capacitor Measurements
        1. 8.1.1.1 Voltage
        2. 8.1.1.2 Current, Charge and Discharge Counting
        3. 8.1.1.3 Device Calibration
        4. 8.1.1.4 Temperature
        5. 8.1.1.5 Series Capacitor Configuration
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Capacitance Monitoring and Learning
        1. 8.3.1.1 Monitoring and Control Operational Overview
        2. 8.3.1.2 Main Monitoring Registers
        3. 8.3.1.3 Initial Capacitance at Device Reset
        4. 8.3.1.4 Qualified Capacitance Learning
        5. 8.3.1.5 Health Determination
        6. 8.3.1.6 ESR Measurement
        7. 8.3.1.7 Monitor Operating Modes
      2. 8.3.2 Capacitor Voltage Balancing
      3. 8.3.3 Charge Control
        1. 8.3.3.1 Charge Termination
        2. 8.3.3.2 CHG Over Ride Control
      4. 8.3.4 Lifetime Data Gathering
        1. 8.3.4.1 Lifetime Maximum Temperature
        2. 8.3.4.2 Lifetime Minimum Temperature
        3. 8.3.4.3 Lifetime Maximum Capacitor Voltage
      5. 8.3.5 Safety Detection Features
        1. 8.3.5.1  Capacitor Overvoltage (OV)
        2. 8.3.5.2  Capacitor Voltage Imbalance (CIM)
        3. 8.3.5.3  Weak Capacitor (CLBAD)
        4. 8.3.5.4  Overtemperature (OT)
        5. 8.3.5.5  Overcurrent During Charging (OC Chg)
        6. 8.3.5.6  Overcurrent During Discharging (OC Dsg)
        7. 8.3.5.7  Short-Circuit During Charging (SC Chg)
        8. 8.3.5.8  Short-Circuit During Discharging (SC Dsg)
        9. 8.3.5.9  AFE Watchdog (WDF)
        10. 8.3.5.10 Integrated AFE Communication Fault (AFE_C)
        11. 8.3.5.11 Data Flash Fault (DFF)
        12. 8.3.5.12 FAULT Indication (FAULT Pin)
      6. 8.3.6 Communications
        1. 8.3.6.1 SMBus On and Off State
      7. 8.3.7 Security (Enables and Disables Features)
      8. 8.3.8 Measurement System Calibration
        1. 8.3.8.1  Coulomb Counter Deadband
        2. 8.3.8.2  Auto Calibration
        3. 8.3.8.3  Current Gain
        4. 8.3.8.4  CC Delta
        5. 8.3.8.5  Cap1 K-factor
        6. 8.3.8.6  Cap2 K-factor
        7. 8.3.8.7  Cap3 K-factor
        8. 8.3.8.8  Cap4 K-factor
        9. 8.3.8.9  Cap5 K-factor
        10. 8.3.8.10 K-factor Override Flag
        11. 8.3.8.11 System Voltage K-factor
        12. 8.3.8.12 Stack Voltage K-factor
        13. 8.3.8.13 K-factor Stack Override Flag
        14. 8.3.8.14 CC Offset
        15. 8.3.8.15 Board Offset
        16. 8.3.8.16 Int Temp Offset
        17. 8.3.8.17 Ext1 Temp Offset
        18. 8.3.8.18 CC Current
        19. 8.3.8.19 Voltage Signal
        20. 8.3.8.20 Temp Signal
        21. 8.3.8.21 CC Offset Time
        22. 8.3.8.22 ADC Offset Time
        23. 8.3.8.23 Current Gain Time
        24. 8.3.8.24 Voltage Time
        25. 8.3.8.25 Temperature Time
        26. 8.3.8.26 Cal Mode Timeout
        27. 8.3.8.27 Ext Coef a1..a5, b1..b4, Ext rc0, Ext adc0
        28. 8.3.8.28 Rpad
        29. 8.3.8.29 Rint
        30. 8.3.8.30 Int Coef 1..4, Int Min AD, Int Max Temp
        31. 8.3.8.31 Filter
        32. 8.3.8.32 Deadband
        33. 8.3.8.33 CC Deadband
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Power Modes
    5. 8.5 Programming
      1. 8.5.1 Communications
        1. 8.5.1.1 bq33100 Slave Address
        2. 8.5.1.2 SMBus On and Off State
        3. 8.5.1.3 Packet Error Checking
      2. 8.5.2 SBS Commands
        1. 8.5.2.1 SBS Command Summary
        2. 8.5.2.2 SBS Command Details
          1. 8.5.2.2.1  ManufacturerAccess (0x00)
            1. 8.5.2.2.1.1  Device Type (0x0001)
            2. 8.5.2.2.1.2  Firmware Version (0x0002)
            3. 8.5.2.2.1.3  Hardware Version (0x0003)
            4. 8.5.2.2.1.4  DF Checksum (0x0004)
            5. 8.5.2.2.1.5  Seal Device (0x0020)
            6. 8.5.2.2.1.6  Lifetime and Capacitor Balancing Enable (0x0021)
            7. 8.5.2.2.1.7  FAULT Activation (0x0030)
            8. 8.5.2.2.1.8  FAULT Clear (0x0031)
            9. 8.5.2.2.1.9  CHGLVL0 Activation (0x0032)
            10. 8.5.2.2.1.10 CHGLVL0 Clear (0x0033)
            11. 8.5.2.2.1.11 CHGLVL1 Activation (0x0033)
            12. 8.5.2.2.1.12 CHGLVL1 Clear (0x0034)
            13. 8.5.2.2.1.13 Learn Load Activation (0x0037)
            14. 8.5.2.2.1.14 Learn Load Clear (0x0038)
            15. 8.5.2.2.1.15 Calibration Mode (0x0040)
            16. 8.5.2.2.1.16 Reset (0x0041)
            17. 8.5.2.2.1.17 Unseal Device (UnsealKey)
            18. 8.5.2.2.1.18 Extended SBS Commands
          2. 8.5.2.2.2  Temperature (0x08)
          3. 8.5.2.2.3  Voltage (0x09)
          4. 8.5.2.2.4  Current (0x0a)
          5. 8.5.2.2.5  ESR (0x0b)
          6. 8.5.2.2.6  RelativeStateofCharge (0x0d)
          7. 8.5.2.2.7  Health (0x0e)
          8. 8.5.2.2.8  Capacitance (0x10)
          9. 8.5.2.2.9  ChargingCurrent (0x14)
          10. 8.5.2.2.10 ChargingVoltage (0x15)
          11. 8.5.2.2.11 CapacitorVoltage5..1 (0x3b..0x3f)
          12. 8.5.2.2.12 Extended SBS Commands
            1. 8.5.2.2.12.1 FETControl(0x46)
            2. 8.5.2.2.12.2 SafetyAlert (0x50)
            3. 8.5.2.2.12.3 SafetyStatus (0x51)
            4. 8.5.2.2.12.4 OperationStatus (0x54)
            5. 8.5.2.2.12.5 SystemVoltage (0x5a)
            6. 8.5.2.2.12.6 UnSealKey(0x60)
            7. 8.5.2.2.12.7 ManufacturerInfo(0x70)
      3. 8.5.3 Data Flash
        1. 8.5.3.1 Accessing Data Flash
        2. 8.5.3.2 Data Flash Interface
        3. 8.5.3.3 Data Flash Summary
        4. 8.5.3.4 Specific Data Flash Programming Details
          1. 8.5.3.4.1  OC Dsg
          2. 8.5.3.4.2  OC Dsg Time
          3. 8.5.3.4.3  SC Dsg Cfg
          4. 8.5.3.4.4  SC Chg Cfg
          5. 8.5.3.4.5  Initial Full Charge Capacitance
          6. 8.5.3.4.6  Full Charge Capacitance
          7. 8.5.3.4.7  Firmware Version
          8. 8.5.3.4.8  Hardware Revision
          9. 8.5.3.4.9  Manuf. Info
          10. 8.5.3.4.10 Operation Cfg
          11. 8.5.3.4.11 FET ACTION
          12. 8.5.3.4.12 FAULT
          13. 8.5.3.4.13 AFE State_CTL
          14. 8.5.3.4.14 Measurement Margin %
          15. 8.5.3.4.15 Timer
          16. 8.5.3.4.16 V Chg Nominal
          17. 8.5.3.4.17 V Chg A
          18. 8.5.3.4.18 V Chg B
          19. 8.5.3.4.19 V Chg Max
          20. 8.5.3.4.20 Min Voltage
          21. 8.5.3.4.21 Learning Frequency
          22. 8.5.3.4.22 Dsg Current Threshold
          23. 8.5.3.4.23 Chg Current Threshold
          24. 8.5.3.4.24 Quit Current
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting Number of Series Capacitor Support
        2. 9.2.2.2 Selecting Charging Voltage Values
        3. 9.2.2.3 Learning Frequency Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 文档支持

12.1.1 相关文档　

相关文档如下：

《bq33100 超级电容管理器 - 13 个关键的设计注意事项》，SLUA751

12.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.