SLUSFH4A March   2025  – July 2025 BQ25858-Q1 , BQ25858B-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Power-On-Reset
      2. 7.3.2  Device Power-Up From Battery Without Input Source
      3. 7.3.3  Device Power Up From Input Source
        1. 7.3.3.1 VAC Operating Window Programming (ACUV and ACOV)
        2. 7.3.3.2 MODE Pin Configuration
        3. 7.3.3.3 REGN Regulator (REGN LDO)
        4. 7.3.3.4 Compensation-Free Buck-Boost Converter Operation
          1. 7.3.3.4.1 Light-Load Operation
        5. 7.3.3.5 Switching Frequency and Synchronization (FSW_SYNC)
        6. 7.3.3.6 Device HIZ Mode
      4. 7.3.4  Power Management
        1. 7.3.4.1 Output Voltage Programming (VOUT_REG)
        2. 7.3.4.2 Output Current Programming (IOUT pin and IOUT_REG)
        3. 7.3.4.3 Dynamic Power Management: Input Voltage and Input Current Regulation
          1. 7.3.4.3.1 Input Current Regulation
            1. 7.3.4.3.1.1 IIN Pin
            2. 7.3.4.3.1.2 Multi-Level Current Limit (Overload Mode)
          2. 7.3.4.3.2 Input Voltage Regulation
        4. 7.3.4.4 Bypass Mode
      5. 7.3.5  Bidirectional Power Flow and Programmability
      6. 7.3.6  Switching Frequency Dithering Feature
      7. 7.3.7  Integrated 16-Bit ADC for Monitoring
      8. 7.3.8  Status Outputs (PG, STAT and INT)
        1. 7.3.8.1 Power Good Indicator (PG)
        2. 7.3.8.2 Converter Status Indicator (STAT Pin)
        3. 7.3.8.3 Interrupt to Host (INT)
      9. 7.3.9  Protections
        1. 7.3.9.1 Voltage and Current Monitoring
          1. 7.3.9.1.1 VAC Over-voltage Protection (VAC_OVP)
          2. 7.3.9.1.2 VAC Under-voltage Protection (VAC_UVP)
          3. 7.3.9.1.3 Reverse Mode Over-voltage Protection (REV_OVP)
          4. 7.3.9.1.4 Reverse Mode Under-voltage Protection (REV_UVP)
          5. 7.3.9.1.5 DRV_SUP Under-voltage and Over-voltage Protection (DRV_OKZ)
          6. 7.3.9.1.6 REGN Under-voltage Protection (REGN_OKZ)
        2. 7.3.9.2 Thermal Shutdown (TSHUT)
      10. 7.3.10 Serial Interface
        1. 7.3.10.1 Data Validity
        2. 7.3.10.2 START and STOP Conditions
        3. 7.3.10.3 Byte Format
        4. 7.3.10.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.3.10.5 Target Address and Data Direction Bit
        6. 7.3.10.6 Single Write and Read
        7. 7.3.10.7 Multi-Write and Multi-Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Host Mode and Default Mode
      2. 7.4.2 Register Bit Reset
    5. 7.5 BQ25858-Q1/858B-Q1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application (Buck-Boost configuration)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 ACUV / ACOV Input Voltage Operating Window Programming
          2. 8.2.1.2.2 Switching Frequency Selection
          3. 8.2.1.2.3 Inductor Selection
          4. 8.2.1.2.4 Input (VAC) Capacitor
          5. 8.2.1.2.5 Output (VBAT) Capacitor
          6. 8.2.1.2.6 Sense Resistor (RAC_SNS and RBAT_SNS) and Current Programming
          7. 8.2.1.2.7 Converter Fast Transient Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application (Buck-only configuration)
        1. 8.2.2.1 Design Requirements
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RRV|36
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.2 Layout Example

Based on the above layout guidelines, the buck-boost PCB layout example top view is shown below including all the key power components.

BQ25858-Q1 BQ25858B-Q1 PCB Layout Reference Example Top ViewFigure 8-26 PCB Layout Reference Example Top View

For both input and output current sensing resistors, differential sensing and routing method are suggested and highlighted in figure below. Use wide trace for gate drive traces, minimum 20-mil trace width. Connect all analog grounds to a dedicated low-impedance copper plane, which is tied to the power ground underneath the IC exposed pad.

BQ25858-Q1 BQ25858B-Q1 PCB Layout Gate Drive and Current Sensing Signal Layer RoutingFigure 8-27 PCB Layout Gate Drive and Current Sensing Signal Layer Routing