SLAS600C May   2008  – December 2016 ADS8319

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: +VBD ≥ 4.5 V
    7. 7.7 Timing Requirements: 4.5 V > +VBD ≥ 2.375 V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Driver Amplifier Choice
      3. 8.3.3 Driver Amplifier Configurations
      4. 8.3.4 Reference
      5. 8.3.5 Power Saving
      6. 8.3.6 Digital Output
      7. 8.3.7 SCLK Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 CS Mode
        1. 8.4.1.1 3-Wire CS Mode Without Busy Indicator
        2. 8.4.1.2 3-Wire CS Mode With Busy Indicator
        3. 8.4.1.3 4-Wire CS Mode Without Busy Indicator
        4. 8.4.1.4 4-Wire CS Mode With Busy Indicator
      2. 8.4.2 Daisy-Chain Mode
        1. 8.4.2.1 Daisy-Chain Mode Without Busy Indicator
        2. 8.4.2.2 Daisy-Chain Mode With Busy Indicator
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (December 2015) to C Revision

  • Added ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Functional Block Diagram, Application and Implementation section, Power Supply Recommendations section, and Layout sectionGo
  • Changed all references of MSOP to VSSOP Go
  • Changed all references of SON to VSON Go
  • Moved Operation temperature From: Electrical Characteristics table To: Recommended Operating Conditions table Go
  • Changed Thermal impedance, RθJA, values in Thermal Information table From: 180°C/W To: 107.5°C/W (VSSOP) and From: 70°C/W To: 87.2°C/W (VSON)Go

Changes from A Revision (September 2013) to B Revision

  • Deleted data from the Device Comparison Table this is repeated in the POAGo
  • Changed External Reference Input, VREF parameter maximum specificationGo
  • Changed VDD to +VA in first sentence fo the Reference sectionGo
  • Changed Figure 51: added +VBD to device SDI connectionGo
  • Changed Figure 57: changed device number for device blocksGo
  • Changed Figure 58: changed SDO #2 traceGo
  • Changed Figure 59: changed device number for device blocksGo
  • Changed Figure 60: changed SDO #2 traceGo

Changes from * Revision (May 2008) to A Revision

  • Changed CBC to CEN in Ordering InformationGo
  • Changed CBE to CEP in Ordering InformationGo