ZHCSSA6C september   2009  – june 2023 ADS1000-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog-to-Digital Converter
      2. 7.3.2 Clock Generator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Reset and Power Up
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
      2. 7.5.2 ADS1000-Q1 I2C Addresses
      3. 7.5.3 I2C General Call
      4. 7.5.4 I2C Data Rates
      5. 7.5.5 Output Code Calculation
    6. 7.6 Register Maps
      1. 7.6.1 Output Register
      2. 7.6.2 Configuration Register
      3. 7.6.3 Reading From the ADS1000-Q1
      4. 7.6.4 Writing to the ADS1000-Q1
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
        1. 8.1.1.1 Connecting Multiple Devices
        2. 8.1.1.2 Using GPIO Ports For I2C
        3. 8.1.1.3 Single-Ended Inputs
    2. 8.2 Typical Applications
      1. 8.2.1 ADS1000-Q1 With Current-Shunt Monitor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Part Selection
            1. 8.2.1.2.1.1 Gain Settings
            2. 8.2.1.2.1.2 Circuit Implementation
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Low-Side Current Measurement
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) DBV (SOT-23) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 182.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 126.5 °C/W
RθJB Junction-to-board thermal resistance 34.1 °C/W
ψJT Junction-to-top characterization parameter 20.7 °C/W
ψJB Junction-to-board characterization parameter 33.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.