ZHCSEX2C
March 2016 – August 2020
TPD3S014-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings—AEC Specification
6.3
ESD Ratings—IEC Specification
6.4
ESD Ratings—ISO Specification
6.5
Recommended Operating Conditions
6.6
Thermal Information
6.7
Electrical Characteristics: TJ = TA = 25°C
6.8
Electrical Characteristics: –40°C ≤ TA ≤ 105°C
6.9
Typical Characteristics
7
Parameter Measurement Information
18
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Undervoltage Lockout (UVLO)
8.3.2
Enable
8.3.3
Internal Charge Pump
8.3.4
Current Limit
8.3.5
Output Discharge
8.3.6
Input and Output Capacitance
8.4
Device Functional Modes
8.4.1
Operation With VIN < 4 V (Minimum VIN)
8.4.2
Operation With EN Control
8.4.3
Operation of Level 4 IEC 61000-4-2 ESD Protection
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Implementing Active Low Logic
9.2.4
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.3
Power Dissipation and Junction Temperature
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
支持资源
12.3
Trademarks
12.4
静电放电警告
12.5
术语表
13
Mechanical, Packaging, and Orderable Information
12.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。