ZHCSR59E April   2007  – December 2022 TRS3243E

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Detailed Design Procedure
        1. 9.1.1.1 ESD Protection
        2. 9.1.1.2 ESD Test Conditions
        3. 9.1.1.3 Human-Body Model (HBM)
        4. 9.1.1.4 IEC61000-4-2 (Formerly Known as IEC1000-4-2)
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 商标
    4. 10.4 静电放电警告
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information

THERMAL METRIC(1)VQFN (RHB)TSSOP (PW)SOIC (DW)DB (SSOP) UNIT
32 PINS28 PINS28 PINS28 PINS
RθJAJunction-to-ambient thermal resistance34.170.359.076.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance25.921.028.835.8°C/W
RθJBJunction-to-board thermal resistance14.629.230.337.4°C/W
ψJTJunction-to-top characterization parameter0.51.37.87.4°C/W
ψJBJunction-to-board characterization parameter14.628.830.037.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance5.1N/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.