SBVS191B April   2012  – August 2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Start Up
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Input and Output Capacitor Requirements
        2. 8.2.1.2 Output Noise
        3. 8.2.1.3 Dropout Voltage
        4. 8.2.1.4 Transient Response
        5. 8.2.1.5 Minimum Load
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Thermal Information
        1. 10.1.2.1 Thermal Protection
        2. 10.1.2.2 Power Dissipation
        3. 10.1.2.3 Package Mounting
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
  • YZY|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage(2) IN –0.3 7.0 V
EN –0.3 VIN + 0.3 V
OUT –0.3 VIN + 0.3 V
Current OUT Internally limited mA
Temperature Operating virtual junction, TJ –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –55 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –500 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 2.7 6.5 V
IOUT Output current 0.5 200 mA
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS799Lxx UNIT
YZY (DSBGA)
5 PINS
RθJA Junction-to-ambient thermal resistance 143.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.1
RθJB Junction-to-board thermal resistance 84.7
ψJT Junction-to-top characterization parameter 3.8
ψJB Junction-to-board characterization parameter 84.4
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(TYP) + 0.3 V or 2.7 V, whichever is greater; IOUT = 1 mA, VEN = VIN, COUT = 2.2 μF, CNR = 0.01 μF, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range(1) 2.7 6.5 V
VOUT Output voltage range 5.2 6.2 V
Output accuracy, nominal TJ = 25°C –1.0% 1.0%
Output accuracy(1)
Over VIN, IOUT, temperature		 VOUT + 0.3 V ≤ VIN ≤ 6.5 V
500 μA ≤ IOUT ≤ 200 mA		 –2.0% ±1.0% 2.0%
ΔVO(ΔVI) Line regulation(1) VOUT(NOM) + 0.3 V ≤ VIN ≤ 6.5 V 0.02 %/V
ΔVO(ΔIO) Load regulation 500 μA ≤ IOUT ≤ 200 mA 0.002 %/mA
VDO Dropout voltage
(VIN = VOUT(NOM) – 0.1 V)		 VOUT ≥ 3.3 V, IOUT = 200 mA 90 160 mV
ILIM Output current limit(2) VOUT = 0.9 × VOUT(NOM) 220 340 600 mA
IGND Ground pin current 500 μA ≤ IOUT ≤ 200 mA 40 60 μA
ISHDN Shutdown current (IGND) VEN ≤ 0.4 V, 2.7 V ≤ VIN ≤ 6.5 V 0.15 1.0 μA
PSRR Power-supply rejection ratio VIN = 6.5 V, VOUT = 2.85 V,
CNR = 0.01 μF, IOUT = 100 mA		 f = 100 Hz 70 dB
f = 1 kHz 66 dB
f = 10 kHz 51 dB
f = 100 kHz 38 dB
VN Output noise voltage BW = 10 Hz to 100 kHz CNR = 0.01 μF 10.5 × VOUT μVRMS
CNR = none 94 × VOUT μVRMS
Start-up time VOUT = 5.7 V,
RL = 28 Ω, COUT = 2.2 μF		 CNR = 0.01 μF 90 μs
CNR = none 95 μs
VEN(HI) Enable high (enabled) 1.2 VIN V
VEN(LO) Enable low (shutdown) 0 0.4 V
IEN(HI) Enable pin current, enabled VEN = VIN = 6.5 V 0.03 1.0 μA
Tsd Thermal shutdown temperature Shutdown, temperature increasing 165 °C
Reset, temperature decreasing 145 °C
TJ Operating junction temperature –40 125 °C
UVLO Undervoltage lockout VIN rising 1.90 2.20 2.65 V
Hysteresis VIN falling 70 mV
(1) Minimum VIN = VOUT + VDO or 2.7 V, whichever is greater.
(2) The TPS799Lxx has a peak current clamp during EN toggle start-up.

6.6 Typical Characteristics

Over operating temperature range (TJ= –40°C to 125°C), VIN = VOUT(TYP) + 0.3 V or 2.7 V, whichever is greater; IOUT = 1 mA, VEN = VIN, COUT = 2.2 μF, and CNR = 0.01μF, unless otherwise noted. Typical values are at TJ = 25°C.
tc_load_reg_bvs056.gif
VIN = 6.5 V
Figure 1. Load Regulation
tc_vdropout_iout_bvs191.gif
Figure 3. Dropout Voltage vs Output Current
tc_ignd-vin_bvs191.gif
Figure 5. Ground Pin Current vs Input Voltage
tc_ignd-tj02_bvs056.gif
Figure 7. Ground Pin Current (Disabled)
vs Junction Temperature
G002_SBVS191.png
VIN = 6.2 V
Figure 9. Power-Supply Rejection Ratio vs Frequency
G004_SBVS191.png
VIN = 6.5 V
Figure 11. Power-Supply Rejection Ratio vs Frequency
G006_SBVS191.png
VIN = 5.95 V
Figure 13. Power-Supply Rejection Ratio vs Frequency
G007_SBVS191.png
VIN = 6 V
Figure 15. Total Noise vs COUT
G009_SBVS191.png
TPS799Axx
Figure 2. Output Voltage vs Junction Temperature
tc_vdropout_vin_250ma_bvs191.gif
IOUT = 250 mA
Figure 4. Dropout Voltage vs Input Voltage
tc_gnd_pin_iout_bvs056.gif
VIN = 6.5 V
Figure 6. Ground Pin Current vs Output Current
G001_SBVS191.png
VIN = 6.5 V
Figure 8. Power-Supply Rejection Ratio vs Frequency
G003_SBVS191.png
VIN = 5.95 V
Figure 10. Power-Supply Rejection Ratio vs Frequency
G005_SBVS191.png
VIN = 6.2 V
Figure 12. Power-Supply Rejection Ratio vs Frequency
G008_SBVS191.png
VIN = 6 V
Figure 14. Total Noise vs CNR
tc_inrush_bvs191.gif
CIN = COUT = 20 µF IOUT = 47 mA
Figure 16. Inrush Current at EN Turn-On