ZHCSSB2G march   2008  – june 2023 TPS799-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Start-Up
      5. 7.3.5 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Feedback Capacitor Requirements (TPS79901-Q1 Only)
        3. 8.2.2.3 Output Noise
        4. 8.2.2.4 Transient Response
        5. 8.2.2.5 Minimum Load
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
        2. 8.4.1.2 Thermal Consideration
        3. 8.4.1.3 Power Dissipation
        4. 8.4.1.4 Package Mounting
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)(2)TPS799-Q1UNIT
DRV (SON)DDC (SOT-23)
6 PINS5 PINS
RθJAJunction-to-ambient thermal resistance74.2178.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.870.7°C/W
RθJBJunction-to-board thermal resistance145.973.4°C/W
ψJTJunction-to-top characterization parameter0.22.5°C/W
ψJBJunction-to-board characterization parameter54.474.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance 7.2n/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.