ZHCSSB2G
march 2008 – june 2023
TPS799-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagrams
7.3
Feature Description
7.3.1
Internal Current Limit
7.3.2
Shutdown
7.3.3
Dropout Voltage
7.3.4
Start-Up
7.3.5
Undervoltage Lockout (UVLO)
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Input and Output Capacitor Requirements
8.2.2.2
Feedback Capacitor Requirements (TPS79901-Q1 Only)
8.2.2.3
Output Noise
8.2.2.4
Transient Response
8.2.2.5
Minimum Load
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Board Layout Recommendations to Improve PSRR and Noise Performance
8.4.1.2
Thermal Consideration
8.4.1.3
Power Dissipation
8.4.1.4
Package Mounting
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DDC|5
MPDS123E
DRV|6
MPDS216E
散热焊盘机械数据 (封装 | 引脚)
DRV|6
QFND087M
订购信息
zhcssb2g_oa
zhcssb2g_pm
9.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。