SLVSAY9F December   2012  – March 2016 TPS65320-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Regulator
        1. 7.3.1.1  Fixed-Frequency PWM Control
        2. 7.3.1.2  Slope Compensation Output
        3. 7.3.1.3  Pulse-Skip Eco-mode™ Control Scheme
        4. 7.3.1.4  Dropout Operation and Bootstrap Voltage (BOOT)
        5. 7.3.1.5  Error Amplifier
        6. 7.3.1.6  Voltage Reference
        7. 7.3.1.7  Adjusting the Output Voltage
        8. 7.3.1.8  Soft-Start and Tracking Pin (SS/TR)
        9. 7.3.1.9  Overload Recovery Circuit
        10. 7.3.1.10 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
        11. 7.3.1.11 Overcurrent Protection and Frequency Shift
        12. 7.3.1.12 Selecting the Switching Frequency
        13. 7.3.1.13 How to Interface to RT/CLK Pin
        14. 7.3.1.14 Overvoltage Transient Protection
        15. 7.3.1.15 Thermal Shutdown
        16. 7.3.1.16 Small-Signal Model for Loop Response
        17. 7.3.1.17 Simple Small-Signal Model for Peak-Current Mode Control
        18. 7.3.1.18 Small-Signal Model for Frequency Compensation
      2. 7.3.2 LDO Regulator
        1. 7.3.2.1 Charge-Pump Operation
        2. 7.3.2.2 Low-Voltage Tracking
        3. 7.3.2.3 Power-Good Output, nRST
      3. 7.3.3 Enable and Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 2.2-MHz Switching Frequency, 9-V to 16-V Input, 5-V Output Buck Regulator, 3.3-V Output LDO Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Switching Frequency Selection for the Buck Regulator
          2. 8.2.1.2.2  Output Inductor Selection for the Buck Regulator
          3. 8.2.1.2.3  Output Capacitor Selection for the Buck Regulator
          4. 8.2.1.2.4  Catch Diode Selection for the Buck Regulator
          5. 8.2.1.2.5  Input Capacitor Selection for the Buck Regulator
          6. 8.2.1.2.6  Soft-Start Capacitor Selection for the Buck Regulator
          7. 8.2.1.2.7  Bootstrap Capacitor Selection for the Buck Regulator
          8. 8.2.1.2.8  Output Voltage and Feedback Resistor Selection for the Buck Regulator
          9. 8.2.1.2.9  Frequency Compensation Selection for the Buck Regulator
          10. 8.2.1.2.10 LDO Regulator
          11. 8.2.1.2.11 Power Dissipation
            1. 8.2.1.2.11.1 Power Dissipation Losses of the Buck Regulator
          12. 8.2.1.2.12 Power Dissipation Losses of the LDO Regulator
          13. 8.2.1.2.13 Total Device Power Dissipation Losses and Junction Temperature
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design Example With 500-kHz Switching Frequency
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Selecting the Switching Frequency
          2. 8.2.2.2.2 Output Inductor Selection
          3. 8.2.2.2.3 Output Capacitor
          4. 8.2.2.2.4 Compensation
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Inductor (L)
      2. 10.1.2 Input Filter Capacitors (CI)
      3. 10.1.3 Resistive Feedback Networks
      4. 10.1.4 Traces and Ground Plane
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

  • TPS65320-Q1 Design Checklist, SLVA593
  • CISPR25 Radiated Emissions Using TPS65320-Q1, SLVA702
  • User's guide, TPS65320EVM,  SLVU691

11.3 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

PowerPAD is a trademark of TI.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.