ZHCSKE6C July   2019  – February 2020 TPS63810 , TPS63811

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      效率与输出电流间的关系
  4. 4 修订历史记录
  5. 5 器件比较表
  6. 6 Pin Configuration and Functions
    1.     BGA Package (YFF) Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Control Scheme
        1. 8.3.1.1 Buck Operation
        2. 8.3.1.2 Boost Operation
        3. 8.3.1.3 Buck-Boost Operation
      2. 8.3.2  Control Scheme
      3. 8.3.3  Power-Save Mode Operation (PSM)
      4. 8.3.4  Forced-PWM Operation (FPWM)
      5. 8.3.5  Ramp-PWM Operation (RPWM)
      6. 8.3.6  Device Enable (EN)
      7. 8.3.7  Undervoltage Lockout (UVLO)
      8. 8.3.8  Soft Start
      9. 8.3.9  Output Voltage Control
        1. 8.3.9.1 Dynamic Voltage Scaling
      10. 8.3.10 Protection Functions
        1. 8.3.10.1 Input Voltage Protection (IVP)
        2. 8.3.10.2 Current Limit Mode and Overcurrent Protection
        3. 8.3.10.3 Thermal Shutdown
      11. 8.3.11 Power Good
      12. 8.3.12 Load Disconnect
      13. 8.3.13 Output Discharge
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 8.5.3 I2C Update Sequence
    6. 8.6 Register Map
      1. 8.6.1 Register Description
        1. 8.6.1.1 Register Map
        2. 8.6.1.2 Register CONTROL (Slave address: 0b1110101; Register address: 0x01; Default: 0x00 or 0x20)
          1. Table 3. Register CONTROL Field Descriptions
        3. 8.6.1.3 Register STATUS (Slave address: 0b1110101; Register address: 0x02; Default: 0x00)
          1. Table 4. Register STATUS Field Descriptions
        4. 8.6.1.4 Register DEVID (Slave address: 0b1110101; Register address: 0x03; Default: 0x04)
          1. Table 5. Register DEVID Field Descriptions
        5. 8.6.1.5 Register VOUT1 (Slave address: 0b1110101; Register address: 0x04; Default: 0x3C)
          1. Table 6. Register VOUT1 Field Descriptions
        6. 8.6.1.6 Register VOUT2 (Slave address: 0b1110101; Register address: 0x05; Default: 0x42)
          1. Table 7. Register VOUT2 Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 1.8-V to 5.2-V Output Smartphone Power Supply
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Capacitor Selection
          2. 9.2.1.2.2 Inductor Selection
          3. 9.2.1.2.3 Output Capacitor Selection
          4. 9.2.1.2.4 I2C Pullup Resistor Selection
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 接收文档更新通知
    5. 12.5 支持资源
    6. 12.6 商标
    7. 12.7 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.5 Electrical Characteristics

Over operating junction temperature range and recommended supply voltage range (unless otherwise noted). Typical values are at VI = 3.6 V, VO = 3.3 V and TJ = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
IQ;VIN Supply current into VIN VI = 3.6 V, VO = 3.3 V, V(EN) = 3.6 V,
not switching, TJ = 25°C		 13 µA
Supply current into VIN VI = 3.6 V, VO = 0 V, V(EN) = 3.6 V, Output disabled with ENABLE bit in Control Register
TJ = 25°C		   15 µA
ISD Shutdown current into VIN VI = 3.6 V, VO = 0 V, V(EN) = 0 V
TJ = 25°C		 0.35 µA
VIT+ Positive-going UVLO threshold voltage 2 2.1 2.2 V
Vhys UVLO threshold voltage hysteresis 200 mV
I/O SIGNALS
VIT+ Positive-going input threshold voltage SCL, SDA, VSEL 1.2 V
EN 1.07 1.1 1.13
VIT– Negative-going input threshold voltage SCL, SDA, VSEL 0.4 V
EN 0.97 1 1.03
Vhys Hysteresis voltage EN 40 mV
IIH High-level input current SCL, SDA, VSEL V(SCL) = V(SDA) = V(VSEL) = 1.8 V,
no pullup resistor		 ±0.01 ±0.1 µA
IIL Low-level input current SCL, SDA, VSEL V(SCL) = V(SDA) = V(VSEL) = 0 V,
no pullup resistor		 ±0.01 ±0.1 µA
IOL Low-level output current SCL, SDA VOL = 0.4 V 20 mA
IIB Input bias current EN V(EN) = 0 V to 5.5 V ±0.01 ±0.1 µA
POWER STAGE
VO Output voltage range Low range 1.8 4.975 V
High range 2.025 5.2
Output voltage accuracy PWM operation –1.5 1.5 %
PSM operation –1.5 3.5
Default output voltage (RANGE = 0) VSEL = low 3.3 V
VSEL = high 3.45
Switch current limit VI = 2.9 V, VO = 3.6 V,
boost operation, output sourcing current		 5.2 6.5 A
VI = 4.1 V, VO = 3.3 V,
buck operation, output sourcing current		 3.8 4.3 5.2
VI = 5 V, VO = 3.3 V,
reverse-boost operation, output sinking current  		–1.3 –0.35
IT–(PSM) PSM entry threshold (peak) current VI = 4.2 V; VO = 3.3 V 0.85 A
Output discharge current VI = 3.6 V, VO ≥ 0.8 V 50 mA
VT+(PG) Positive-going power-good threshold
voltage		 95 %
VT–(PG) Negative-going power-good
threshold voltage		 90 %
Positive-going input overvoltage threshold Reverse current operation 5.7 V
I2C INTERFACE
7-Bit slave address 75h
THERMAL SHUTDOWN
Thermal shutdown threshold temperature TJ rising 150 °C
Thermal shutdown hysteresis 20 °C