ZHCSI26C August   2010  – April 2018 TPS54320

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
      2.      效率与负载电流间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Continuous Current Mode Operation (CCM)
      3. 7.3.3  VIN and Power VIN Pins (VIN and PVIN)
      4. 7.3.4  Voltage Reference
      5. 7.3.5  Adjusting the Output Voltage
      6. 7.3.6  Safe Start-up into Prebiased Outputs
      7. 7.3.7  Error Amplifier
      8. 7.3.8  Slope Compensation
      9. 7.3.9  Enable and Adjusting UVLO
      10. 7.3.10 Slow Start (SS/TR)
      11. 7.3.11 Power Good (PWRGD)
      12. 7.3.12 Bootstrap Voltage (BOOT) and Low Dropout Operation
      13. 7.3.13 Sequencing (SS/TR)
      14. 7.3.14 Output Overvoltage Protection (OVP)
      15. 7.3.15 Overcurrent Protection
        1. 7.3.15.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.15.2 Low-Side MOSFET Overcurrent Protection
      16. 7.3.16 Thermal Shutdown
      17. 7.3.17 Small Signal Model for Loop Response
      18. 7.3.18 Simple Small Signal Model for Peak Current Mode Control
      19. 7.3.19 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Adjustable Switching Frequency and Synchronization (RT/CLK)
      2. 7.4.2 Adjustable Switching Frequency (RT Mode)
      3. 7.4.3 Synchronization (CLK Mode)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Operating Frequency
        3. 8.2.2.3  Output Inductor Selection
        4. 8.2.2.4  Output Capacitor Selection
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  Slow-Start Capacitor Selection
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  UVLO Set Point
        9. 8.2.2.9  Output Voltage Feedback Resistor Selection
          1. 8.2.2.9.1 Minimum Output Voltage
        10. 8.2.2.10 Compensation Component Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 文档支持
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Overview

The device is a 17-V, 3-A, synchronous step-down (buck) converter with two integrated N-channel MOSFETs. To improve performance during line and load transients the device implements a constant frequency, peak current mode control which also simplifies external frequency compensation. The wide switching frequency of 200 to 1200 kHz allows for efficiency and size optimization when selecting the output filter components. The switching frequency is adjusted using a resistor to ground on the RT/CLK pin. The device also has an internal phase lock loop (PLL) controlled by the RT/CLK pin that can be used to synchronize the switching cycle to the falling edge of an external system clock.

The device has been designed for safe monotonic start-up into prebiased loads. The default start up is when VIN is typically 4.0 V. The EN pin has an internal pullup current source that can be used to adjust the input voltage UVLO with two external resistors. In addition, the EN pin can be left floating for the device to automatically start with the internal pullup current. The total operating current for the device is approximately 600 μA when not switching and under no load. When the device is disabled, the supply current is typically less than 2 μA.

The integrated MOSFETs allow for high-efficiency power supply designs with continuous output currents up to 3 A. The MOSFETs have been sized to optimize efficiency for lower duty cycle applications.

The device reduces the external component count by integrating the boot recharge circuit. The bias voltage for the integrated high-side MOSFET is supplied by a capacitor between the BOOT and PH pins. The boot capacitor voltage is monitored by a BOOT to PH UVLO (BOOT-PH UVLO) circuit allowing PH pin to be pulled low to recharge the boot capacitor. The device can operate at 100% duty cycle, as long as the boot capacitor voltage is higher than the preset BOOT-PH UVLO threshold, which is typically 2.1 V. The output voltage can be stepped down to as low as the 0.8-V voltage reference (Vref).

The device has a power good comparator (PWRGD) with hysteresis which monitors the output voltage through the VSENSE pin. The PWRGD pin is an open drain MOSFET which is pulled low when the VSENSE pin voltage is less than 91% or greater than 109% of the reference voltage Vref and floats high when the VSENSE pin voltage is 94% to 106% of the Vref.

The SS/TR (slow start/tracking) pin is used to minimize inrush currents or provide power supply sequencing during power up. A small value capacitor or resistor divider should be attached to the pin for slow-start or critical power supply sequencing requirements.

The device is protected from output overvoltage, overload, and thermal fault conditions. The device minimizes excessive output overvoltage transients by taking advantage of the overvoltage circuit power good comparator. When the overvoltage comparator is activated, the high-side MOSFET is turned off and prevented from turning on until the VSENSE pin voltage is lower than 106% of the Vref. The device implements both high-side MOSFET overload protection and bidirectional low-side MOSFET overload protections which help control the inductor current and avoid current runaway. If the overcurrent condition has lasted for more than the hiccup wait time, the device will shut down and restart after the hiccup time. The device also shuts down if the junction temperature is higher than thermal shutdown trip point. The device is restarted under control of the slow-start circuit automatically when the junction temperature drops 10°C typically below the thermal shutdown trip point.