ZHCSQS0E August   2006  – January 2024 TPS5410

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Oscillator Frequency
      2. 6.3.2  Voltage Reference
      3. 6.3.3  Enable (ENA) and Internal Slow-Start
      4. 6.3.4  Undervoltage Lockout (UVLO)
      5. 6.3.5  Boost Capacitor (BOOT)
      6. 6.3.6  Output Feedback (VSENSE)
      7. 6.3.7  Internal Compensation
      8. 6.3.8  Voltage Feed-Forward
      9. 6.3.9  Pulse-Width-Modulation (PWM) Control
      10. 6.3.10 Overcurrent Limiting
      11. 6.3.11 Overvoltage Protection
      12. 6.3.12 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Minimum Input Voltage
      2. 6.4.2 ENA Control
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Application Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Switching Frequency
          2. 7.2.1.2.2 Input Capacitors
          3. 7.2.1.2.3 Output Filter Components
            1. 7.2.1.2.3.1 Inductor Selection
            2. 7.2.1.2.3.2 Capacitor Selection
          4. 7.2.1.2.4 Output Voltage Setpoint
          5. 7.2.1.2.5 Boot Capacitor
          6. 7.2.1.2.6 Catch Diode
          7. 7.2.1.2.7 Advanced Information
            1. 7.2.1.2.7.1 Output Voltage Limitations
            2. 7.2.1.2.7.2 Internal Compensation Network
            3. 7.2.1.2.7.3 Thermal Calculations
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Using All Ceramic Capacitors
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Output Filter Capacitor Selection
          2. 7.2.2.2.2 External Compensation Network
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision D (November 2014) to Revision E (January 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated to new format which does not include specific parameter names and does include min and max columns; TJ called out in header Pin names are used rather than signal names; BOOT and PH voltages now marked as output voltage; Footnotes updated and Note 2 removed.Go
  • Changed BOOT to PH Absolute Maximum to 6 V maximumGo
  • Changed CDM ESD to ±750 VGo
  • Added Recommended operating VI input voltageGo
  • Updated footnotes to match current TI standards, replaced custom board specifications with EVM information and JEDEC standard information.Go
  • Changed RθJC(top), RθJB, ψJT, ψJB Go
  • Added condition for typical specifications EC table’s header, added parameter names, and used pin names in parameter descriptions.  Footnote added.Go
  • Updated the following test conditions: VFB, DMAX, and RDSON(HS).Go
  • Updated the following typical specifications in the EC table: IQ(VIN), ISD(VIN), VINUVLO(H), VEN(H), and RDSON(HS).Go
  • Updated typical and maximum ISH(OC) in the EC tableGo

Changes from Revision C (September 2013) to Revision D (November 2014)

  • 添加了“ESD 等级”表、“特性说明”部分、“器件功能模式”、“应用和实施”部分、“电源相关建议”部分、“布局”部分、“器件和文档支持”部分以及“机械、封装和可订购信息”部分Go

Changes from Revision B (January 2013) to Revision C (September 2013)

  • 从数据表标题、特性和说明中删除了 SWIFTGo
  • 从“特性”列表项中删除了“SWIFT 文档”Go
  • 删除了“说明”中的文本“作为 SWIFT™ 直流/直流稳压器系列的一员”Go
  • Updated the following test conditions: VFB, DMAX, and RDSON(HS).Go