SLVS887C April   2009  – August 2014 TPS53114

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematics
  5. Revision History
  6. Pin Configurations and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  PWM Operation
      2. 8.3.2  Drivers
      3. 8.3.3  PWM Frequency and Adaptive On-time Control
      4. 8.3.4  5-Volt Regulator
      5. 8.3.5  Soft Start
      6. 8.3.6  Pre-bias Support
      7. 8.3.7  Switching Frequency Selection
      8. 8.3.8  Output Discharge Control
      9. 8.3.9  Over Current Protection
      10. 8.3.10 Over/under Voltage Protection
      11. 8.3.11 UVLO Protection
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 350-kHz Operation Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choose Inductor
        2. 9.2.2.2 Choose Output Capacitor
        3. 9.2.2.3 Choose Input Capacitor
        4. 9.2.2.4 Choose Bootstrap Capacitor
        5. 9.2.2.5 Choose VREG5 and V5FILT Capacitors
        6. 9.2.2.6 Choose Output Voltage Set Point Resistors
        7. 9.2.2.7 Choose Over Current Set Point Resistor From: IOCL + To: IOCL - minus VOCLoff
        8. 9.2.2.8 Choose Soft Start Capacitor
        9. 9.2.2.9 Choose Package Option
      3. 9.2.3 350 kHz Application Curves
    3. 9.3 700 kHz Operation Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 700 kHz Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage range VIN, EN –0.3 26 V
VBST –0.3 32
VBST - SW –0.3 6
V5FILT, VFB, TRIP, VO, FSEL, CER –0.3 6
Output voltage range DRVH –1 32 V
DRVH - SW –0.3 6
SW –2 26
DRVL, VREG5, SS –0.3 6
PGND –0.3 0.3
TA Operating ambient temperature range –40 85 °C
TJ Junction temperature range –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature –55 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) -2000 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) -500 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply input voltage VIN 4.5 24 V
V5FILT 4.5 5.5
Input voltage VBST –0.1 30 V
VBST - SW –0.1 5.5
VFB, VO, FSEL, CER –0.1 5.5
TRIP –0.1 0.3
EN –0.1 24
Output voltage DRVH –0.1 30 V
VBST - SW –0.1 5.5
SW 1.8 24
DRVL, VREG5, SS –0.1 5.5
PGND –0.1 0.1
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature –40 125 °C

7.4 Thermal Information

THERMAL METRIC(1) TPS53114 UNIT
PWP (16 PINS) PW (16 PINS)
RθJA Junction-to-ambient thermal resistance 51.2 109.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.4 31.2
RθJB Junction-to-board thermal resistance 28.3 54.7
ψJT Junction-to-top characterization parameter 1.4 0.9
ψJB Junction-to-board characterization parameter 28.1 54.1
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.9 n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IIN VIN supply current VIN current, TA = 25°C, VREG5 tied to V5FLT, EN = 5V, VFB = 0.8V, SW = 0.5V 350 600 μA
IVINSDN VIN shutdown current VIN current, TA = 25°C, No Load , EN = 0V, VREG5 = ON 28 60 μA
VFB VOLTAGE and DISCHARGE RESISTANCE
VBG Bandgap Initial regulation accuracy TA = 25°C –1.0% 1.0%
VVFBTHL VFB threshold voltage TA = 25°C , FSEL = 0 V, CER = V5FILT 755 765 775 mV
TA = –40°C to 85°C, FSEL = 0V, CER = V5FILT 752 778
VVFBTHH VFB threshold voltage TA = 25°C , FSEL = CER = V5FILT 748 758 768 mV
TA = –40°C to 85°C, FSEL = CER = V5FILT 745 771
IVFB VFB input current VFB = 0.8V, TA = 25°C –100 –10 100 nA
RDischg Vo discharge resistance EN = 0V, VO = 0.5V, TA = 25°C 40 80 Ω
VREG5 OUTPUT
VVREG5 VREG5 output voltage TA=25°C, 5.5V < VIN < 24V, 0 < IVREG5 < 10mA 4.6 5.0 5.2 V
VLN5 Line regulation 5.5V < VIN < 24V, IVREG5 = 10mA 20 mV
VLD5 Load regulation 1mA < IVREG5 < 10mA 40 mV
IVREG5 Output current VIN = 5.5V, VVREG5 = 4.0V, TA = 25°C 170 mA
OUTPUT: N-CHANNEL MOSFET GATE DRIVERS
RDRVH DRVH resistance Source, IDRVH = –100mA 5.5 11 Ω
Sink, IDRVH = 100mA 2.5 5
RDRVL DRVL resistance Source, IDRVL = –100mA 4 12 Ω
Sink, IDRVL = 100mA 2 4
INTERNAL BST DIODE
VFBST Forward voltage VVREG5-VBST, IF = 10mA, TA = 25°C 0.7 0.8 0.9 V
IVBSTLK VBST leakage current VBST = 29V, SW = 24V, TA = 25°C 0.1 1 µA
SOFT START
Issc SS charge current VSS = 0V , SOURCE CURRENT 1.4 2.0 2.6 µA
Issd SS discharge current VSS = 0.5V , SINK CURRRENT 100 150 µA
UVLO
VUV5VFILT V5FILT UVLO threshold V5FILT rising 3.7 4.0 4.3 V
Hysteresis 0.2 0.3 0.4
LOGIC THRESHOLD
VENH EN H-level threshold voltage EN 2.0 V
VENL EN L-level threshold voltage EN 0.3 V
CURRENT SENSE
ITRIP TRIP source current VTRIP = 0.1V, TA = 25°C 8.5 10 11.5 µA
TCITRIP ITRIP temperature coefficient on the basis of 25°C 4000 ppm/°C
VOCLoff OCP compensation offset (VTRIP-GND-VPGND-SW) voltage,
VTRIP-GND = 60mV, TA = 25°C
–10 0 10 mV
(VTRIP-GND-VPGND-SW) voltage,
VTRIP-GND = 60mV
–15 15
VRtrip Current limit threshold setting range VTRIP-GND voltage 30 200
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
VOVP Output OVP trip threshold OVP detect 110% 115% 120%
VUVP Output UVP trip threshold UVP detect 65% 70% 75%
Hysteresis (recovery <20μs) 10%
THERMAL
TSDN Thermal shutdown threshold Shutdown temperature(1) 150 °C
Hysteresis(1) 20
(1) Specified by design. Not production tested.

7.6 Timing Requirements

PARAMETER MIN TYP MAX UNIT
OUTPUT: N-CHANNEL MOSFET GATE DRIVERS
tD Dead time DRVH-low to DRVL-on 20 50 80 ns
DRVL-low to DRVH-on 20 40 80
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
tOVPDEL Output OVP prop delay 1.5 µs
tUVPDEL Output UVP delay 17 30 40 µs
tUVPEN Output UVP enable delay UVP enable delay / soft start time X1.4 X1.7 X2.0

7.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ON-TIME TIMER CONTROL
tONL On time SW = 12V, VO = 1.8V, FSEL = 0V 390 ns
tONH On time SW = 12V, VO = 1.8V, FSEL = V5FILT 139 ns
tOFFL Min off time SW = 0.7V, TA = 25°C, VFB = 0.7V, FSEL = 0V 285 ns
tOFFH Min off time SW = 0.7V, TA = 25°C, VFB = 0.7V, FSEL = V5FILT 216 ns

7.8 Typical Characteristics

g001_lvs887.gif
Figure 1. VIN Supply Current vs Junction Temperature
g003_lvs887.gif
Figure 3. Trip Source Current vs Junction Temperature
vregvvi_lvs887.gif
Figure 5. VREG5 Voltage vs Input Voltage
vfbvvi_lvs887.gif
Figure 7. VFB Voltage vs Input Voltage
g006_lvs887.gifFigure 9. Switching Frequency vs. Output Current
g007_lvs887.gif
Figure 11. Switching Frequency vs. Output Current
g002_lvs887.gif
Figure 2. VIN Shutdown Current vs Junction Temperature
vregvt_lvs887.gif
Figure 4. VREG5 Voltage
vfbvt_lvs887.gif
VO = 1.05 V, IO = 4 A
Figure 6. VFB Voltage vs Temperature
g004_lvs887.gifFigure 8. Switching Frequency (IO = 1 A) vs. Input Voltage
g005_lvs887.gif
Figure 10. Switching Frequency vs. Input Voltage