ZHCSF57 June   2016 TPS51200-EP

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Sink and Source Regulator (VO Pin)
      2. 7.3.2  Reference Input (REFIN Pin)
      3. 7.3.3  Reference Output (REFOUT Pin)
      4. 7.3.4  Soft-Start Sequencing
      5. 7.3.5  Enable Control (EN Pin)
      6. 7.3.6  Powergood Function (PGOOD Pin)
      7. 7.3.7  Current Protection (VO Pin)
      8. 7.3.8  UVLO Protection (VIN Pin)
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Tracking Start-up and Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low-Input Voltage Applications
      2. 7.4.2 S3 and Pseudo-S5 Support
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical VTT DIMM Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Output Tolerance Consideration for VTT DIMM Applications
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 3.3-VIN, DDR2 Configuration
      2. 8.3.2 2.5-VIN, DDR3 Configuration
      3. 8.3.3 3.3-VIN, LP DDR3 or DDR4 Configuration
      4. 8.3.4 3.3-VIN, DDR3 Tracking Configuration
      5. 8.3.5 3.3-VIN, LDO Configuration
      6. 8.3.6 3.3-VIN, DDR3 Configuration with LFP
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Design Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 开发支持
        1. 11.1.2.1 评估模块
        2. 11.1.2.2 Spice 模型
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 开发支持

11.1.2.1 评估模块

评估模块 (EVM) 可与 TPS51200-EP 器件配套使用,协助评估电路初始性能。TPS51200-EPEVM 评估模块及相关用户指南(文献编号:SLUU323)可在德州仪器 (TI) 网站的产品文件夹下或直接从 TI eStore 获取。

11.1.2.2 Spice 模型

分析模拟电路和系统的性能时,使用 SPICE 模型对电路性能进行计算机仿真非常有用。点击此处可获取 TPS51200-EP 的 SPICE 模型。

11.2 文档支持

11.2.1 相关文档

  • 《使用新的热指标》SBVA025
  • 《半导体和 IC 封装热指标》SPRA953
  • 《使用 TPS51200-EP EVM 灌/拉电流 DDR 终端稳压器》SLUU323
  • 有关 TPS51100 器件的更多信息,请参见 ti.com 上的产品文件夹。

11.3 接收文档更新通知

如需接收文档更新通知,请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册后,即可每周定期收到已更改的产品信息。有关更改的详细信息,请查阅已修订文档中包含的修订历史记录。

11.4 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

11.7 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.